150pF 20V MOS Capacitor Halogen Free Ceramic Chip Capacitor With S Parameter Data

HACC151S20V101 Compliance-Verified MOS Capacitor: Halogen-Free 150pF with Full Metrology Traceability

The HACC151S20V101 is a 150pF ±10% single-layer MOS capacitor rated at 20V DC, sharing the float-zone silicon substrate, 300nm thermal SiO₂ dielectric, and TiW-Au metallization platform. Chip dimensions are 0.50mm * 0.50mm * 0.15mm. This variant is engineered for customers requiring documented regulatory compliance, measurement traceability to national standards, and comprehensive materials provenance data as part of their component qualification process.

1. Regulatory Compliance Framework for Electronic Passive Components

Modern electronics supply chains must navigate a multi-layered regulatory landscape. The HACC151S20V101 is designed and documented to satisfy the key frameworks applicable to passive components:

• EU RoHS Directive 2011/65/EU (recast 2015/863): Restricts lead, mercury, cadmium, hexavalent chromium, PBB, PBDE, DEHP, BBP, DBP, and DIBP to maximum concentration values of 0.1% by weight in homogeneous materials (0.01% for cadmium). The HACC151S20V101 is intrinsically RoHS-compliant at the materials level—the silicon substrate, SiO₂ dielectric, TiW barrier, Au electrodes, and Pt barrier contain none of the restricted substances by design. The optional AuSn pre-deposition uses gold-tin eutectic, not tin-lead, preserving RoHS compliance.
• Halogen-free per IEC 61249-2-21: Defines halogen-free as chlorine <900ppm, bromine <900ppm, and total chlorine+bromine <1500ppm. Verification is performed by combustion ion chromatography (CIC) on homogenized chip samples from each materials lot, with detection limits below 50ppm for each halogen. The all-inorganic materials set—silicon, SiO₂, TiW, Au, Pt, AuSn—contains no halogens by composition, eliminating the need for ongoing lot-by-lot screening for these elements.
• EU REACH Regulation (EC) 1907/2006: The Candidate List of Substances of Very High Concern (SVHC) is updated by ECHA twice yearly (typically January and July). Each production lot is screened against the then-current Candidate List. A declaration of conformity confirming absence of listed SVHCs above 0.1% w/w per article is available. For customers integrating the capacitor into products sold in the EU, this declaration supports their own REACH Article 33 communication obligations.
• EU WEEE Directive 2012/19/EU: While WEEE primarily targets finished electronic equipment, the absence of halogenated flame retardants and the use of easily separable, non-toxic materials in the HACC151S20V101 support end-of-life recycling and recovery targets set by the Directive.

2. S-Parameter Metrology: Measurement Science and Traceability

The S-parameter data provided with each lot is not simply a representative measurement—it is the output of a defined metrology process traceable to national calibration standards:

• VNA calibration chain: Measurements are performed on a calibrated vector network analyzer (Keysight PNA-X or equivalent) using a ground-signal-ground (GSG) wafer probe station. The calibration sequence uses an impedance standard substrate (ISS) with Thru-Reflect-Line (TRL) or Short-Open-Load-Thru (SOLT) standards. The ISS standards are characterized by the manufacturer with traceability to NIST (National Institute of Standards and Technology) through a cascade of mechanical and electrical transfer standards.
• De-embedding methodology: Raw S-parameter measurements include the effects of the probe pads and the interconnect between the VNA reference plane and the device under test (DUT). A two-step de-embedding process is applied: first, pad parasitic capacitances and inductances are removed using open-short de-embedding structures fabricated on the same wafer. Second, any residual probe-to-pad contact resistance is calibrated out using thru structures. The resulting de-embedded S-parameters represent the intrinsic chip behavior at the electrode plane.
• Measurement uncertainty budget: The combined standard uncertainty for S₂₁ magnitude (series configuration) is typically ±0.05dB below 10GHz, increasing to ±0.15dB at 20GHz. Capacitance derived from S-parameters (C = -1/(2πf·Im(Z₁₁)) typically agrees with the 1MHz C-V measurement within ±2% at low frequencies, confirming consistency between DC and RF characterization methods.
• Data format and delivery: S-parameter data is provided as Touchstone version 1.1 (.s2p) files with frequency points spaced logarithmically (100 points per decade) from 100MHz to 20GHz. File headers include measurement date, instrument model, calibration method, probe type, bias conditions, and temperature. Files are compatible with all major RF simulation platforms including Keysight ADS, Ansys HFSS, Cadence AWR Microwave Office, and open-source tools such as scikit-rf.

3. Materials Provenance and Supply Chain Integrity

Beyond regulatory compliance, the HACC151S20V101 supports customers' broader responsible sourcing commitments:

• Conflict minerals (Dodd-Frank Section 1502 / EU Regulation 2017/821): The gold used in the top and backside metallization is sourced exclusively from London Bullion Market Association (LBMA) Good Delivery List refiners that are also certified under the Responsible Minerals Assurance Process (RMAP). The CMRT (Conflict Minerals Reporting Template, currently version 6.4) is completed annually and available on request. The template covers tin, tantalum, tungsten, and gold (3TG) originating from the Democratic Republic of Congo and adjoining countries.
• Full Material Disclosure (FMD): For customers requiring complete materials composition data—for example, to populate their own product-level lifecycle assessment (LCA) or to verify compatibility with specific chemical exposure environments—IPC-1752A Class D declarations are available under non-disclosure agreement. These declarations list every intentionally added substance in the component, with CAS numbers and mass ranges, at the homogeneous material level.
• Silicon wafer provenance: Float-zone silicon wafers are sourced from qualified suppliers with ISO 9001:2015 and IATF 16949 certifications. Wafer lot traceability is maintained through fabrication, with each finished chip traceable to the ingot, crystal growth run, and wafer position through the serialized lot traveller system.

Key Features

• 100% Halogen-Free and RoHS/REACH Compliant: Verified halogen content <50ppm each by CIC. Full RoHS 2015/863 and REACH SVHC compliance declarations per production lot. IPC-1752A Class D FMD available under NDA.
• Full S-Parameter Metrology Package: VNA characterization 100MHz-20GHz with NIST-traceable TRL/SOLT calibration. Touchstone .s2p files with open-short de-embedded data. Measurement uncertainty budget documented. Compatible with Keysight ADS, Ansys HFSS, Cadence AWR, and scikit-rf.
• Verified Materials Supply Chain: RMAP-certified gold supply. CMRT 6.4 conflict minerals reporting. Float-zone silicon wafer lot traceability to ingot level. ISO 9001:2015 and IATF 16949 qualified wafer suppliers.
• Superior Thermal Performance: 148 W/m·K silicon substrate, θ_JC <30 K/W with AuSn attach. Under 1.5°C junction rise at typical operating power.
• Data Retention: Lot-specific test data, S-parameters, and materials declarations retained for minimum 5 years, supporting long-lifecycle infrastructure and industrial programs.

Electrical Specifications (T = 25°C unless noted)

Documentation Deliverables Matrix

Typical Applications

• Medical device electronics (IEC 60601 compliance programs) requiring full materials disclosure for biocompatibility risk assessment and regulatory submission packages
• Telecommunications infrastructure (NEBS Level 3, ETSI environmental standards) where halogen-free procurement policies are enforced by network operators
• Automotive electronic control units requiring PPAP Level 3 documentation as part of the production part qualification process
• Scientific and metrology-grade instrumentation where component S-parameter traceability supports system-level measurement uncertainty analysis
• High-reliability industrial controls with 10-15 year service life requiring guaranteed long-term documentation availability
• Sustainability-focused product lines where conflict minerals reporting and halogen-free status are marketing and compliance requirements

Ordering and Qualification Support

Standard shipments include the Lot Test Summary, S-parameter data, RoHS declaration, REACH SVHC declaration, and halogen-free certificate. For programs requiring PPAP, FAI, or full material disclosure, specify documentation requirements at the RFQ stage. Our quality team can provide sample documentation packages for evaluation prior to order placement.

Contact us to discuss your compliance documentation, metrology, or materials traceability requirements.

Xi'an Hoan Microwave Co., Ltd. was established in 2005. The company is located in the High-tech Zone of Xi'an. The company covers an area of ​​800 square meters, including 500 square meters of production area and 300 square meters of office area. It is a professional enterprise specializing in the development, production, sales and technical services of and civilian electronic components, cable assemblies, high-precision electrical connectors, vibration isolators, microwave antennas, waterproof breathable valves and other products.

Our products are widely used in electronic equipment, aviation communications, postal and telecommunications, civilian electrical appliances, instrumentation and other technical fields. The products are sold all over the country. At present, there are more than 100 and civilian customers.

Hoan has obtained ISO9001:2005 quality management system certification and equipment quality management system certification. Since its establishment, the company has strictly organized and implemented operations in accordance with the standard requirements of the quality management system. The product quality is stable and reliable. There have been no customer complaints about quality and leakage accidents, and no production safety accidents.