Double Sided Bordered Single Layer Capacitor 100pF 50V Low ESR Capacitor

HACC101S10V500 Double-Sided Bordered SLC (100pF,50V)

What is a Double-Sided Bordered Single Layer Capacitor?
For high-reliability microelectronic packaging, securing both the top and bottom of a chip capacitor is critical. The HACC101S10V500 is designed as a Double-Sided Bordered (Margin) Single Layer Capacitor.

Unlike single-bordered variants, this chip features an un-metallized, exposed ceramic border (Margin) on both the top and bottom surfaces.

•Top Margin: Prevents gold wire-bonding short circuits from accidental alignment drifts.
•Bottom Margin: Prevents conductive silver epoxies (e.g., H20E) from migrating up the vertical sidewalls of the chip during bottom die attachment.

This dual-barrier architecture guarantees that even under automated, high-volume production, the rate of epoxy-induced short-circuiting is reduced to absolute zero.

The Science Behind TaN/TiW/Ni/Au Thin-Film Metallization

The HACC101S10V500 stands out due to its multi-layer TaN/TiW/Ni/Au (Tantalum Nitride / Titanium-Tungsten / Nickel / Gold) metallization on both electrodes (thickness ≥ 2.5 µm Min). Here is why this complex film system is critical for microwave modules:

1.TaN (Tantalum Nitride) Layer: Serves as an ultra-robust adhesion layer, locking the metallization to the ceramic dielectric body and preventing electrode peeling under high-temperature baking.
2.TiW (Titanium-Tungsten) Barrier: Blocks the diffusion of copper or underlying substrate materials into the gold layer.
3.Ni (Nickel) Barrier Layer: Acts as an industry-standard anti-leaching barrier. It prevents gold-leaching (dissolution of gold into solder or epoxies) during high-temperature reflow or silver-epoxy curing.
4.Au (Gold) Top Coat: Offers a highly solderable, non-oxidizing surface optimized for thermosonic gold wire bonding (Au wire-bonding), ensuring outstanding pull-strength.

Dimensions

Technical Specifications (HACC101S10V500)

Micro-Assembly & Wire Bonding Best Practices
To ensure the mechanical longevity of the HACC101S10V500 in your hybrid microcircuits:

1.Conductive Epoxy Mounting:
•Highly optimized for conductive silver epoxy (e.g., H20E).
•Recommended Baking Profile: Cure at 120℃ for 30 minutes for optimal shear strength and electrical conductivity.
2.Wire Bonding Landing Area:
•To prevent localized micro-fractures in the single-layer ceramic structure, the gold-wire bonding wedge/ball must land at least 25 µm away from the gold pad’s outer edge.
3.Sidewall Inspection:
•Thanks to the double-sided margin, the bottom epoxy fillet is safely contained. Visually inspect under a microscope to ensure no epoxy reaches the top gold pad.

FAQ

Q1: Why is HACC101S10V500 rated at 50V while some others are 100V?
A: The 50V rating allows the use of an optimized dielectric thickness, enabling a higher capacitance value of 100pF in an extremely compact physical package. This is ideal for lower-voltage high-capacity decoupling paths in RF bias tees.

Q2: Can I solder directly to the TaN/TiW/Ni/Au electrodes?
A: Yes. The nickel (Ni) barrier layer prevents the gold from leaching into lead-free or leaded solders during high-temperature reflow, preserving the integrity of the solder joint.

Q3: What are the storage requirements to prevent bonding failure?
A: Store the capacitors in standard waffle packs or gel-paks inside a nitrogen cabinet or dry box at 20–25℃ and 40%–60% RH. Under these conditions, the shelf life is guaranteed for 1 year with pristine bondability.

Xi'an Hoan Microwave Co., Ltd. was established in 2005. The company is located in the High-tech Zone of Xi'an. The company covers an area of ​​800 square meters, including 500 square meters of production area and 300 square meters of office area. It is a professional enterprise specializing in the development, production, sales and technical services of and civilian electronic components, cable assemblies, high-precision electrical connectors, vibration isolators, microwave antennas, waterproof breathable valves and other products.

Our products are widely used in electronic equipment, aviation communications, postal and telecommunications, civilian electrical appliances, instrumentation and other technical fields. The products are sold all over the country. At present, there are more than 100 and civilian customers.

Hoan has obtained ISO9001:2005 quality management system certification and equipment quality management system certification. Since its establishment, the company has strictly organized and implemented operations in accordance with the standard requirements of the quality management system. The product quality is stable and reliable. There have been no customer complaints about quality and leakage accidents, and no production safety accidents.