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EMMC Test Socket BGA100 BGA153 Socket Zero Footprint Design No PCB Modification Needed

Categories BGA Test Socket
Brand Name: Sireda
Model Number: Open Top
Certification: ISO9001
Place of Origin: China
MOQ: 1
Price: Get Quote
Pitch: ≥0.3mm
Pin Count: 2-2000+
Compatible Packages:: BGA, QFN, LGA, SOP, WLCSP
Socket Type: Open Top
Conductor Type: Probe Pins, Pogo Pin, PCR
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EMMC Test Socket BGA100 BGA153 Socket Zero Footprint Design No PCB Modification Needed

High-Performance Zero-Footprint Sockets for eMMC (BGA100 & BGA153) Testing
Our ultra-compact eMMC test sockets provide a fast, reliable testing solution with a direct-solder design --requiring no PCB modifications for hassle-free validation of embedded memory chips.
Key Features:
  • Perfect Chip-Sized Interposer - Matches BGA100 & BGA153 footprints precisely
  • No Need for PCB Cutouts - Solder directly onto test boards for instant use
  • Two Versions for Different Testing Needs:
    • F Series (Standard) - Simplified contact-only testing
    • F1 Series (Enhanced) - Test points for signal and power analysis (great for debugging)
  • High-Speed Compatibility - Supports fast eMMC 5.1 & UFS interface validation
  • Durable & Reliable - Over 10,000 mating cycles
Ideal For:
  • Manufacturers conducting production testing on eMMC chips
  • R & D Teams validating board-level eMMC performance
  • Repair & Debugging labs analyzing signal integrity
eMMC test socket
F VS F1 Solution
eMMC BGA153 eMMC BGA100

The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details

UfseMCPeMMCDDRLPDDRNAND
BGA254BGA221BGA153BGA78BGA200BGA132
BGA153BGA162BGA96BGA315BGA136
BGA169BGA152
BGA100BGA154
BGA254

F vs F1 Solution Comparison
F vs F1 Solution Comparison
Installation Steps:
  1. Solder interposer -> test board
  2. Attach test socket
  3. Insert chip & lock cover
Test socket installation steps
Buy EMMC Test Socket BGA100 BGA153 Socket Zero Footprint Design No PCB Modification Needed at wholesale prices
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