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High Density EMCP Test Socket For BGA221 Packages Zero Footprint

Categories BGA Test Socket
Brand Name: Sireda
Model Number: Open Top
Certification: ISO9001
Place of Origin: China
MOQ: 1
Price: Get Quote
Pitch: ≥0.3mm
Pin Count: 2-2000+
Compatible Packages:: BGA, QFN, LGA, SOP, WLCSP
Socket Type: Open Top
Conductor Type: Probe Pins, Pogo Pin, PCR
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High Density EMCP Test Socket For BGA221 Packages Zero Footprint

High-Density eMCP Testing Solution for BGA221 Packages

Revolutionize your embedded memory validation with our zero-footprint BGA221 eMCP test socket. The precision-engineered interposer matches the exact chip footprint, enabling direct solder mounting without PCB modifications.

Key Advantages:
  • Instant deployment with no PCB milling requirements
  • Two configurations available:
    • F-Series: Standard contact solution
    • F1-Series: Integrated test points for signal analysis
  • Supports LPDDR+NAND stacked packages
  • Gold-plated contacts ensure > 10,000 test cycles
  • Compact 2.5mm profile ideal for dense boards
Technical Specs:
✔ BGA221 compatibility (0.5mm pitch)
✔ Supports JEDEC eMCP standards
✔ Operating temp: -40°C to +125°C
✔ Signal integrity up to 4266Mbps
Perfect for:

Memory manufacturers, smartphone repair centers, embedded system developers

BGA221 eMCP test socket Close-up of test socket contacts

The image is for reference only. All items listed below include zero-footprint sockets. Please contact us for details

UfseMCPeMMCDDRLPDDRNAND
BGA254BGA221BGA153BGA78BGA200BGA132
BGA153BGA162BGA96BGA315BGA136
BGA169BGA152
BGA100BGA154
BGA254
F vs F1 Solution Comparison
F vs F1 solution comparison chart
Installation Steps:

Solder interposer -> test board

Attach test socket

Insert chip & lock cover

Test socket installation steps
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