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Rogers RT duroid5870 Copper Clad Laminate Sheet

Categories Copper Clad Laminates
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Part number: Rogers RT duroid 5870
Laminate thickness: 0.127mm 0.254mm 0.381mm 0.508mm 0.787mm 1.575mm 3.175mm
Laminate size: 18X12 inch(457X305mm); 18X24 inch(457X610mm)
Copper weight: 0.5OZ(0.018MM), 1OZ(0.035mm)
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Rogers RT duroid5870 Copper Clad Laminate Sheet

RT/duroid 5870 is a glass microfiber-reinforced PTFE composite engineered specifically for high-precision stripline and microstrip circuit implementations.


The material’s randomly oriented microfiber architecture delivers exceptional dielectric constant (Dk) uniformity—a characteristic that ensures consistent Dk values not only across individual panels, but also over a broad operating frequency spectrum. Combined with its inherently low dissipation factor (Df), this attribute extends the material’s applicability to Ku-band and higher-frequency systems.


RT/duroid 5870 laminates exhibit outstanding machinability, enabling straightforward cutting, shearing, and precision shaping. Furthermore, the composite demonstrates robust resistance to all solvents and chemical reagents—whether hot or cold—commonly utilized in printed circuit etching, as well as edge and through-hole plating processes.


As a standard offering, RT/duroid 5870 is supplied as double-sided copper-clad laminates, featuring electrodeposited copper (EDC) with a thickness range of ½–2 oz/ft² (8–70 µm) or reverse-treated EDC variants. For applications demanding more stringent electrical performance, the composite can also be clad with rolled copper foil. Custom cladding options, including aluminum, copper, or brass plate, are available upon specification.


Critical Notes for Ordering: To ensure accurate fulfillment, orders for RT/duroid 5870 laminates must clearly specify the following parameters: dielectric thickness and corresponding tolerance, copper foil type (rolled, electrodeposited, or reverse-treated EDC), and required copper foil weight.



Key Features

  • Industry-leading low electrical loss among reinforced PTFE materials
  • Minimal moisture absorption
  • Isotropic material characteristics
  • Consistent electrical performance across a broad frequency range
  • Superior chemical resistance


Typical Applications

  • Commercial aviation broadband antennas
  • Microstrip and stripline circuits
  • Millimeter-wave systems
  • Military radar systems
  • Missile guidance systems
  • Point-to-point digital radio antennas

RT/duroid 5870 Typical Value
PropertyRT/duroid 5870DirectionUnitsConditionTest Method
Dielectric Constant,εProcess2.33
2.33±0.02 spec.
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign2.33ZN/A8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor,tanδ0.0005
0.0012
ZN/AC24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε-115Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
Volume Resistivity2 x 107ZMohm cmC/96/35/90ASTM D 257
Surface Resistivity3 x 107ZMohmC/96/35/90ASTM D 257
Specific Heat0.96(0.23)N/Aj/g/k
(cal/g/c)
N/ACalculated
Tensile ModulusTest at 23℃Test at 100℃N/AMPa(kpsi)AASTM D 638
1300(189)490(71)X
1280(185)430(63)Y
Ultimate Stress50(7.3)34(4.8)X
42(6.1)34(4.8)Y
Ultimate Strain9.88.7X%
9.88.6Y
Compressive Modulus1210(176)680(99)XMPa(kpsi)AASTM D 695
1360(198)860(125)Y
803(120)520(76)Z
Ultimate Stress30(4.4)23(3.4)X
37(5.3)25(3.7)Y
54(7.8)37(5.3)Z
Ultimate Strain44.3X%
3.33.3Y
8.78.5Z
Moisture Absorption0.02N/A%0.62"(1.6mm) D48/50ASTM D 570
Thermal Conductivity0.22ZW/m/k80℃ASTM C 518
Coefficient of Thermal Expansion22
28
173
X
Y
Z
ppm/℃0-100℃IPC-TM-650 2.4.41
Td500N/A℃ TGAN/AASTM D 3850
Density2.2N/Agm/cm3N/AASTM D 792
Copper Peel27.2(4.8)N/APli(N/mm)1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
FlammabilityV-0N/AN/AN/AUL 94
Lead-free Process CompatibleYesN/AN/AN/AN/A

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