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High Frequency CuClad 217 Copper Clad Laminate

Categories Copper Clad Laminates
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Part number: CuClad 217
Laminate thickness: 0.25mm, 0.51mm, 0.79mm, 1.57mm
Laminate size: 18"X12"(457X305mm); 18"X24"(457X610mm)
Copper weight: 0.5OZ(0.018mm)1OZ(0.035mm)
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High Frequency CuClad 217 Copper Clad Laminate

CuClad® laminates are composite materials composed of woven fiberglass and polytetrafluoroethylene (PTFE), engineered specifically for deployment as printed circuit board (PCB) substrates. By precisely regulating the fiberglass-to-PTFE ratio, CuClad laminates deliver a diversified product portfolio: ranging from variants with ultra-low dielectric constant and loss tangent to highly reinforced grades optimized for enhanced dimensional stability.


Compared with non-woven fiberglass-reinforced PTFE laminates of equivalent dielectric constants, the woven fiberglass reinforcement in CuClad products confers superior dimensional stability. The consistent, tightly controlled PTFE coating process applied to the fiberglass cloth enables Rogers to supply laminates with a broader spectrum of dielectric constant options, as well as improved dielectric constant uniformity relative to comparable non-woven fiberglass-reinforced alternatives. These performance attributes position CuClad as a preferred material solution for fabricating filters, couplers, and low-noise amplifiers.


A defining characteristic of CuClad laminates is their cross-ply construction: successive layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This unique design ensures true electrical and mechanical isotropy across the XY plane—a feature exclusive to CuClad laminates that no other woven or non-woven fiberglass-reinforced PTFE laminates on the market can match. For certain phased array antenna applications, designers have verified that this level of isotropy is a critical performance prerequisite.


CuClad 217 (with a dielectric constant Er of 2.17–2.20) leverages a low fiberglass-to-PTFE ratio to achieve the minimum dielectric constant and dissipation factor among all fiberglass-reinforced PTFE laminates. Combined, these properties facilitate faster signal propagation speeds and elevated signal-to-noise ratios.

Features & Benefits
-Cross-ply woven fiberglass structure, with alternating plies oriented at 90° to each other
-High PTFE-to-glass ratio
-Superior dielectric constant uniformity versus comparable non-woven fiberglass-reinforced laminates
-Electrical and mechanical isotropy in the XY plane
-Ultra-low signal loss
-Ideal for circuits sensitive to dielectric constant (Er) variations

Typical Applications
-Military electronics systems (including radars, electronic countermeasures (ECM), and electronic support measures (ESM))
-Microwave components (such as low-noise amplifiers (LNAs), filters, and couplers)

PropertiesTest MethodConditionCuClad 217
Dielectric Constant @10 GHzIPC TM-650 2.5.5.5C23/502.17, 2.20
Dielectric Constant @1MHzIPC TM-650 2.5.5.3C23/502.17, 2.20
Dissipation Factor @10 GHzIPC TM-650 2.5.5.5C23/500.0009
Thermal Coefficient of Er (ppm/°C)IPC TM-650 2.5.5.5 Adapted-10°C to +140°C-160
Peel Strength (lbs.per inch)IPC TM-650 2.4.8After Thermal Stress14
Volume Resistivity (MΩ-cm)IPC TM-650 2.5.17.1C96/35/902.3×10⁸
Surface Resistivity (MΩ)IPC TM-650 2.5.17.1C96/35/903.4×10⁶
Arc Resistance (seconds)ASTM D-495D48/50>180
Tensile Modulus(kpsi)ASTM D-638A, 23°C275, 219
Tensile Strength (kpsi)ASTM D-882A, 23°C8.8, 6.6
Compressive Modulus(kpsi)ASTM D-695A, 23°C237
Flexural Modulus(kpsi)ASTM D-790A, 23°C357
Dielectric Breakdown (kv)ASTM D-149D48/50>45
Specific Gravity (g/cm³)ASTM D-792 Method AA, 23°C2.23
Water Absorption (%)MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2E1/105 + D24/230.02

Coefficient of Thermal Expansion (ppm/°C)

- X Axis

- Y Axis

- Z Axis

IPC TM-650 2.4.24

Mettler 3000

Thermomechanical

Analyzer

0°C to 100°C29
28
246
Thermal ConductivityASTM E-1225100°C0.26

Outgassing - Total Mass Loss (%)

Collected Volatile Condensable Material (%)

Water Vapor Regain (%)

Visible Condensate (±)

NASA SP-R-0022A

Maximum 1.00%

Maximum 0.10%

125°C, ≤10⁻⁶ torr


0.01

0.01

0.00

NO

FlammabilityUL 94 Vertical Burn; IPC TM-650 2.3.10C48/23/50, E24/125Meets UL94-V0

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