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| Categories | BGA Assembly |
|---|---|
| MOQ: | No MOQ |
| Supply Ability: | 100,000 pieces/month |
| Packaging Details: | ESD Protective Packaging/Customization |
| Delivery Time: | 5-25 working days(varies by product) |
| Place of Origin: | China |
| Price: | Quote based on your specs |
| Payment Terms: | T/T |
| Company Info. |
| Studio Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Overview
Managing separate vendors for component sourcing, SMT assembly, BGA process optimization, and X-Ray inspection creates complexity and quality gaps. Studio Electronics simplifies BGA production with Turnkey BGA Assembly—one-stop SMT solutions covering every stage. As a premier provider of PCB assembly in China, we manage your entire BGA project: component procurement, SMT assembly, specialized BGA process control, 100% X-Ray inspection, and final shipping. Our 12 automated SMT lines and advanced inspection systems deliver reliable BGA assemblies with complete accountability.
One-Stop BGA Service – Everything Under One Roof
| Service Component | Studio Capability | Quality Assurance |
|---|---|---|
| Component Sourcing | Authorized distributors; full BOM procurement | Incoming inspection; LCR testing; traceability |
| SMT Assembly | 12 automated SMT lines; ±25μm accuracy | SPI; AOI; real-time process monitoring |
| BGA Placement | Fine-pitch to large BGAs; vision alignment | ±25μm accuracy; optimized placement parameters |
| Controlled Reflow | Custom profiles per BGA type; nitrogen option | Thermal profile validation per BGA package |
| X-Ray Inspection | 2D and 3D X-Ray—100% coverage | Void analysis; automated void calculation |
| Testing | ICT; Flying Probe; FCT—100% coverage | Documented results per board serial number |
| Final Assembly | Box-build; wiring; enclosure assembly | Functional verification; visual inspection |
| Shipping | Anti-static packaging; customs clearance | Packaging verification; tracking; on-time delivery |
Our Turnkey BGA Assembly Process
Stage 1: Component Sourcing – Components procured through authorized distributors. For low volume PCB assembly, small-quantity procurement supported.
Stage 2: Engineering Review – BGA design review; reflow profile optimization; stencil design.
Stage 3: SMT Assembly – 12 SMT lines with ±25μm accuracy. BGA placement with vision alignment.
Stage 4: Controlled Reflow – Custom profiles per BGA type. Nitrogen reflow available. Real-time monitoring.
Stage 5: X-Ray Inspection – 100% coverage; 2D and 3D X-Ray; void analysis; automated void calculation.
Stage 6: Testing & Final Assembly – ICT; Flying Probe; FCT. Careful handling; anti-static packaging; global logistics.
Why One-Stop Turnkey BGA Assembly Matters
Simplified Management – One supplier; one point of contact; one invoice
Consistent Quality – Unified standards across all stages
Reduced Lead Times – Eliminate vendor handoff delays
Full Traceability – Complete documentation from component to finished assembly
Low Volume Support – Competitive pricing for low volume PCB assembly
Studio delivers Turnkey BGA Assembly—one-stop SMT solutions with 100% X-Ray verification on every BGA board.
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Full Service BGA Assembly PCB Manufacturing And Assembly OEM ODM
Small Volume PCB Assembly BGA Prototype Circuit Board Manufacturing
Fine Pitch BGA Assembly Precision Ball Grid Array Assembly High Density
Advanced BGA PCB Assembly High Reliability SMT Service Custom
High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs
Professional PCB Assembly BGA Precision Soldering Ball Grid Array Assembly
Void Free BGA PCB Assembly X Ray Testing OEM PCB Manufacturing
Zero Defect BGA Assembly X Ray Certified PCB Board Manufacturer
Rapid PCB Assembly BGA 24hr Prototype PCB Assembly Services
Flexible Ball Grid Array Assembly ODM Low Volume PCB Manufacturing
