| Sign In | Join Free | My infospaceinc.com |
|
| Sign In | Join Free | My infospaceinc.com |
|
| Categories | BGA Assembly |
|---|---|
| MOQ: | No MOQ |
| Delivery Time: | 5-25 working days(varies by product) |
| Place of Origin: | China |
| Supply Ability: | 100,000 pieces per month |
| Packaging Details: | ESD Protective Packaging/Customization |
| Price: | Quote based on your specs |
| Payment Terms: | T/T |
| Company Info. |
| Studio Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Overview
Low-volume BGA assembly requires the same specialized expertise as high-volume production—but with the flexibility to support small quantities efficiently. Studio Electronics offers Flexible BGA Assembly with low-volume PCB service, supporting prototype through pilot production quantities. As a customer-focused provider of PCB assembly in China, we treat every low volume PCB assembly order—whether 1 board or 100 boards—with the same quality standards and X-Ray verification. Our 12 automated SMT lines and specialized BGA process expertise deliver reliable BGA assemblies for any quantity.
Low-Volume BGA Assembly – Our Capabilities
| Parameter | Studio Capability | Quality Assurance |
|---|---|---|
| Order Quantity | 1-100 boards; no MOQ | Same quality standards as volume production |
| BGA Types | Fine-pitch; large; micro; PBGA; CBGA | Customized process per BGA type |
| Component Sourcing | Authorized distributors; small-quantity procurement | LCR testing; visual verification; traceability |
| SMT Assembly | 12 SMT lines with quick-changeover | ±25μm accuracy; vision alignment |
| X-Ray Inspection | 2D and 3D X-Ray—100% coverage | Void analysis; automated void calculation |
| Testing | Flying Probe; FCT | Electrical verification; functional testing |
Our Low-Volume BGA Assembly Process
Stage 1: Component Sourcing
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported with competitive pricing.
Stage 2: SMT Assembly
12 SMT lines with quick-changeover. BGA placement with ±25μm
accuracy. Vision alignment ensures accurate ball-to-pad
registration.
Stage 3: Controlled Reflow
Custom reflow profiles optimized per BGA type. Nitrogen reflow
available. Real-time temperature monitoring.
Stage 4: X-Ray Inspection (100% Coverage)
2D X-Ray for ball alignment and bridging; 3D X-Ray for void
analysis. Automated void calculation. Inspection results per board
serial number.
Stage 5: Testing & Final Assembly
Flying Probe testing; FCT for functional verification. Careful
handling; anti-static packaging; global logistics.
Why Choose Studio for Low-Volume BGA Assembly?
No MOQ – Order exactly what you need; no quantity penalties
BGA Expertise – Specialized process knowledge; X-Ray verification
Quick Turnaround – Expedited options for prototype and pilot runs
Same Quality Standards – 100% X-Ray inspection regardless of quantity
Complete Service – Sourcing through assembly and shipping—one point of contact
Studio delivers Flexible BGA Assembly—low-volume PCB service with 100% X-Ray verification on every BGA board.
|
Full Service BGA Assembly PCB Manufacturing And Assembly OEM ODM
Small Volume PCB Assembly BGA Prototype Circuit Board Manufacturing
Fine Pitch BGA Assembly Precision Ball Grid Array Assembly High Density
Advanced BGA PCB Assembly High Reliability SMT Service Custom
High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs
Professional PCB Assembly BGA Precision Soldering Ball Grid Array Assembly
Void Free BGA PCB Assembly X Ray Testing OEM PCB Manufacturing
Zero Defect BGA Assembly X Ray Certified PCB Board Manufacturer
Rapid PCB Assembly BGA 24hr Prototype PCB Assembly Services
Small-Batch BGA Assembly – No MOQ Required
