High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

Overview

High-density BGA assemblies—multiple BGAs on a single board, fine-pitch packages, and complex PCB layouts—demand exceptional process control. Studio Electronics offers High-Density BGA Assembly with specialized capability for complex, multi-BGA boards. As a premier provider of PCB assembly in China, our 12 automated SMT lines, advanced X-Ray inspection systems, and experienced process engineering team deliver reliable assemblies for the most complex BGA configurations. From component procurement through final shipping, our complete turnkey service ensures every BGA is placed accurately, soldered reliably, and verified with 100% X-Ray inspection.

Stage 1: Component Sourcing & Engineering Review
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Engineering review identifies BGA type variations and recommends process parameters.

Stage 2: Solder Paste Application
Precision stencil design with optimized aperture geometry. 3D SPI ensures consistent paste deposition across all BGA pads.

Stage 3: SMT Assembly (Multiple BGAs)
12 automated SMT lines with ±25μm accuracy. Sequential or simultaneous BGA placement optimized for board layout. Vision systems ensure precise alignment.

Stage 4: Controlled Reflow
Reflow profiles optimized for multiple BGA types on the same board. Thermal balancing ensures consistent soldering across all BGAs. Nitrogen reflow available.

Stage 5: 100% X-Ray Inspection
Comprehensive X-Ray verification per BGA: 2D imaging for ball alignment and bridging; 3D void analysis with automated void calculation. Inspection records per board serial number.

Stage 6: Quality Verification
ICT and Flying Probe testing; FCT for functional verification; AOI for visible components. Reliability lab testing available.

Stage 7: Final Assembly & Shipping
Careful handling; anti-static packaging; global logistics.

• Multi-BGA Expertise – Experience with complex, high-density BGA configurations

• 100% X-Ray Inspection – Every BGA on every board verified

• Advanced Equipment – 12 SMT lines; 3D X-Ray void analysis

• Complete Turnkey – Sourcing through assembly and shipping—one point of contact

• Low Volume Support – Competitive pricing for low volume PCB assembly

Studio delivers High-Density BGA Assembly—PCB SMT specialist for complex, multi-BGA boards with full X-Ray verification.