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| Categories | BGA Assembly |
|---|---|
| MOQ: | No MOQ |
| Supply Ability: | 100,000 pieces/month |
| Packaging Details: | ESD Protective Packaging/Customization |
| Delivery Time: | 5-25 working days(varies by product) |
| Place of Origin: | China |
| Price: | Quote based on your specs |
| Payment Terms: | T/T |
| Company Info. |
| Studio Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Product development cycles demand speed—especially when validating BGA designs. Studio Electronics offers Fast BGA Assembly with quick-turn PCBA service, combining specialized BGA process expertise with expedited production workflows. As a responsive provider of PCB assembly in China, our 12 automated SMT lines, dedicated prototype team, and advanced X-Ray inspection enable rapid turnaround for BGA assemblies—from component procurement through final testing. Our complete turnkey service delivers reliable BGA boards when you need them.
| Service Element | Quick-Turn Capability | Quality Assurance |
|---|---|---|
| Component Sourcing | Rapid procurement through authorized distributors | Incoming inspection; traceability |
| BGA Placement | 12 SMT lines with dedicated prototype team | ±25μm accuracy; vision alignment |
| Reflow | Pre-validated profiles for common BGA types | Controlled reflow; nitrogen option |
| X-Ray Inspection | 2D and 3D X-Ray; rapid turnaround | 100% coverage; void analysis |
| Testing | Flying Probe; FCT—rapid testing | Electrical verification; functional testing |
| Shipping | Expedited shipping options | Anti-static packaging; tracking |
Stage 1: Rapid Component Sourcing
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Smart Material Rack enables
immediate component allocation.
Stage 2: Quick-Changeover SMT
12 SMT lines with quick-changeover capability. Rapid machine setup
for BGA placement. Dedicated prototype team prioritizes expedited
orders.
Stage 3: Controlled Reflow
Pre-validated reflow profiles for common BGA types. Rapid thermal
characterization for new BGA packages.
Stage 4: Expedited X-Ray Inspection
Priority X-Ray inspection scheduling. 2D and 3D X-Ray analysis;
automated void calculation. 100% coverage on every BGA board.
Stage 5: Rapid Testing & Final Assembly
Flying Probe testing (no fixture wait); FCT for functional
verification. Careful handling; anti-static packaging; expedited
shipping with tracking.
Design Validation – Validate BGA designs quickly; identify issues early
Development Speed – Accelerate product development cycles
Design Iteration – Multiple BGA design iterations in shortened timeframes
Competitive Advantage – Faster time-to-market
Low Volume Support – Quick-turn for low volume PCB assembly and prototypes
Studio delivers Fast BGA Assembly—quick-turn PCBA service with 100% X-Ray verification on every BGA board.
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Zero Defect BGA Assembly X Ray Certified PCB Board Manufacturer
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