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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: F4BTMS450
Layer count: 4 layers
PCB thickness: 1.4mm
PCB size: 20mm x 20mm per unit (tolerance: ±0.15mm)
Silkscreen: No
Solder mask: No
Copper weight: 1oz (1.4 mils / 35μm)
Surface finish: Immersion Gold
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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick

RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick
This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.
PCB Specification
ParameterSpecification
Base MaterialF4BTMS450 (advanced PTFE-nano-ceramic composite)
Layer Configuration4-layer rigid PCB
Board Dimensions20mm x 20mm per unit (tolerance: ±0.15mm)
Finished Board Thickness1.4mm
Copper Weight (Finished)1oz (1.4 mils / 35μm)
Via Plating Thickness20μm
Minimum Trace/Space4 mils / 5 mils
Minimum Hole Size0.3mm
Vias4 total (no blind vias)
Surface FinishImmersion Gold
SilkscreenTop: No; Bottom: No
Solder MaskTop: No; Bottom: No
Quality Assurance100% Electrical test prior to shipment
Precise PCB Stack-up
  • Copper Layer 1: 35μm (1oz)
  • F4BTMS450 Core: 0.127mm (5mil)
  • Copper Layer 2: 35μm (1oz)
  • Prepreg RO4450F: 0.102mm (4mil)
  • F4BTMS450 Core: 0.127mm (5mil)
  • Copper Layer 3: 35μm (1oz)
  • Prepreg RO4450F: 0.102mm (4mil)
  • F4BTMS450 Core: 0.762mm (30mil)
  • Copper Layer 4: 35μm (1oz)
RF/Microwave F4BTMS450 PCB close-up view
F4BTMS450 Material Advantages
F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:
  • Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
  • Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
  • Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
  • Low thermal expansion coefficient and stable dielectric temperature characteristics.
  • Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).
F4BTMS450 Key Electrical & Mechanical Properties
PropertySpecification
Dielectric Constant (Dk)4.5 ±0.09 (10GHz)
Dissipation Factor (Df)0.0015 (10GHz); 0.0019 (20GHz)
Coefficient of Thermal Expansion (CTE)X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk-58 ppm/°C (-55°C to 150°C)
Flame RatingUL-94 V0
Thermal Conductivity0.64 W/MK
Moisture Absorption0.08% (max)
Typical Applications
This PCB is ideal for demanding environments and high-performance systems, including:
  • Aerospace equipment, space vehicles, and cabin systems
  • Microwave and RF (Radio Frequency) devices
  • Military radar and general radar systems
  • Feed networks for high-frequency applications
  • Phase-sensitive antennas and phased array antennas
  • Satellite communications systems
  • Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.
RF/Microwave F4BTMS450 PCB in application
Buy RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick at wholesale prices
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