Gold Plated Ultra-Fine Precision Spring Test Probe with Customizable Tip Styles for BGA Testing and Semiconductor Applications

1. Ultra-Fine Precision Design

Features a 0.11 mm plunger and 0.15 mm barrel, suitable for micro-pitch PCB pads, IC leads, flex circuits, and semiconductor testing.

2. High Conductivity Gold Plating

Both plunger and barrel are gold-plated to ensure low contact resistance, stable signal transmission, and long service life under repeated testing cycles.

3. Multiple Tip Styles Available

Supports B tip (60° cone), U tip, D tip, and fully customized tip geometry for different test pad types—ideal for solder balls, via holes, metal pads, and fine-pitch components.

4. Durable Spring Structure

Equipped with stainless-steel spring (SUS material) providing stable working stroke and reliable contact force, suitable for ICT/FCT test fixtures, flying probe testers, and automatic test equipment.

5. Custom Manufacturing & Fast Delivery

OEM/ODM accepted. Materials, plunger diameter, spring force, stroke, and tip shape can all be customized. Suitable for high-volume production with fast delivery from our factory.

Product Images

Comparison of different test probe tip types and configurations

At SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD., we offer comprehensive customization for our brass barrel stainless steel spring test probes:

• Custom diameters to match your specific requirements
• Custom plating thicknesses for optimal conductivity and durability
• Custom mechanical specifications tailored to your application

All products include material traceability documentation and certificate of analysis for quality assurance. Contact us to request samples or a quotation for your specific application requirements.

Our probe manufacturing facility

Quality control inspection

Packaged probes ready for shipment