Fan Out 2.5D Chip Automated Glue Dispenser
The SS101 Wafer-Level Dispensing Machine is an advanced underfill
dispensing solution engineered for the demanding requirements of
Fan-Out 2.5D Chip on Wafer on Substrate (CoWoS) processes. Equipped
with dedicated underfill valves, the SS101 precisely dispenses fine
volumes for small bump and narrow pitch applications, ensuring
optimal flow without voids or bridging. Its programmable dispensing
path and real-time temperature compensation effectively minimize
thermal fluctuations during dispensing — a crucial factor for
achieving uniform underfill in delicate 2.5D stacked chip
structures.
An integrated weighing calibration module and whole-process video
monitoring enable precise glue weight control and easy
traceability, while ESD protection complies fully with IEC and ANSI
standards to safeguard sensitive wafers throughout the process.
Core Advantages
- Perfect for Small Bump, Tight Pitch & Low SOH: Support ultra-small bump dimensions and low stand-off height
encapsulation without overflow or air gaps.
- Dedicated Underfill Valve Control: Custom-designed underfill dispensing valve ensures stable,
consistent flow with minimal clogging and bubble formation.
- Stable Thermal Management: Integrated preheating, chuck table with uniform heating, and
automatic temperature correction prevent thermal stress and resin
defects.
- Programmable Dispensing Path: Flexible path editing supports complex wafer-level layouts and
variable fill depths, improving efficiency and precision.
Application Areas
- Fan-Out 2.5D Chip on Wafer on Substrate (CoWoS)
- RDL First FoWLP (Fan-Out Wafer-Level Packaging)
- High-Density ASIC/CPU/GPU Underfill
- Advanced Packaging for High-Performance Computing
- Small Bump Fine-Pitch Wafer Encapsulation
Technical Specifications
| SS101 Wafer Level Dispensing Machine | Specifications |
|---|
| Application Range | Wafer Configuration | φ200±0.5mm/φ300±0.5mm (Standard version supports 12-inch only) |
| Wafer Thickness | 300~25500 μm |
| Max. Acceptable Wafer Warp | 5mm (subject to Finger model selection) |
| Max. Wafer Weight | 600g (subject to Finger model selection) |
| Supported Wafer-box Type | 8-inch Open Cassette/ 12-inch Foup (Standard version supports
12-inch only) |
| PC101 (EFEM) | Loading & Unloading Method | Landport +Robot Arm |
| Pre-Aligner Precision | Circle center correction deviation ≤ ±0.1 mm Angle correction
deviation ≤ ±0.2° |
| Wafer Reader | Supporting SEMI fonts (flat or embossed surfaces), non-SEMI fonts |
| Jetting System | Transmission System | X/Y: Linear motor Z: Servo motor&Screw module |
| Repeatability (3sigma) | X/Y:±3 μm Z:±5 μm |
| Positioning Accuracy (3sigma) | X/Y:±10 μm |
| Max. Speed | X/Y:1000mm/s Z: 500mm/s |
| Max. Acceleration | X/Y:1g Z: 0.5g |
| Visual System | Pixel | 130W |
| Identify Accuracy | ±1pixel |
| Identify Range | 10*12mm |
| Light Resource | Red, Green, White combined light + extra red illumination |
| Chuck Table | Vacuum Suction Planeness Deviation | ≤30 μm |
| Heating Temperature Deviation | ±1.5℃ |
| Lifting height repeatability | ±10 μm |
| Vacuum Suction Pressure | -85~-70KPa (Settable) |
| General Condition | Footprint W* D * H | 3075*2200*2200mm (Display screen unfold) |
| Operation Environment Temperature | 23℃±3℃ |
| Operation Environment Humidity | 30-70% |
Frequently Asked Questions
Q1: How does the SS101 handle small bumps and tight pitches?
A: The system's dedicated underfill valves, high-resolution vision,
and precise motion ensure exact glue placement for bumps,
minimizing voids and resin spread.
Q2: What makes its thermal management unique?
A: The integrated chuck table and preheating system deliver uniform
wafer temperature, while real-time feedback auto-corrects heat
drift, preventing thermal stress and warping.
Q3: Does it support AMHS integration?
A: Yes — the PC101 EFEM module connects seamlessly with AMHS robots
for automated wafer handling and improved production efficiency.
Q4: Is the SS101 suitable for RDL First processes like FoPoP and
CoWoS?
A: Absolutely — it's purpose-built for high-end RDL First FoWLP
lines, including CoWoS and FoPoP, where underfill precision is
mission-critical.
How to Choose a Wafer-Level Underfill Dispensing Machine
Selecting the right wafer-level dispensing system is critical for
advanced semiconductor packaging yield. Evaluate the following
factors to match your process requirements:
1. Wafer Size Compatibility — Verify the machine supports your wafer diameter (200mm or
300mm). The SS101 standard configuration handles 12-inch wafers,
with 8-inch available as an option. Consider future production
scaling when selecting a platform.
2. Bump Pitch and Stand-Off Height — For ultra-small bump dimensions and low stand-off heights below
30μm, look for systems with dedicated underfill valves and
high-resolution vision (130W pixel or higher) to ensure void-free
encapsulation without bridging.
3. Positioning and Dispensing Accuracy — Wafer-level underfill demands micron-level precision. Check
repeatability specifications — the SS101 achieves ±3μm X/Y and ±5μm
Z (3σ), suitable for the most demanding CoWoS and FoWLP processes.
4. Thermal Management System — Uniform chuck heating with deviation under ±2°C prevents thermal
stress and warping during dispensing. Integrated preheating and
real-time temperature compensation are essential for consistent
underfill flow.
5. Automation and EFEM Integration — For high-volume fabs, confirm the system supports AMHS robot
integration via EFEM (Equipment Front End Module). The SS101 PC101
module includes landport loading and robot arm handling for
lights-out operation.
6. Weighing Calibration and Traceability — Inline precision weighing (0.01mg accuracy) with automatic
volume correction ensures every dispense meets specification.
Whole-process video monitoring adds an extra layer of quality
traceability.
7. ESD Protection and Cleanroom Compliance — Verify that the system meets IEC and ANSI ESD standards, and is
compatible with your cleanroom class requirements (ISO 14644-1
Class 5 or better for advanced packaging).
How It Works: SS101 Wafer-Level Underfill Process
The SS101 executes a fully automated wafer-level dispensing
sequence designed for high-precision semiconductor packaging:
Step 1 — Wafer Loading: The PC101 EFEM module retrieves wafers from FOUP or open cassette
via robot arm. The pre-aligner corrects wafer center position to
within ±0.1mm and angular deviation to ±0.2° before transfer to the
chuck table.
Step 2 — Wafer Identification: An integrated OCR reader scans the wafer ID (supporting both SEMI
and non-SEMI fonts on flat or embossed surfaces), automatically
loading the correct dispensing recipe for that wafer.
Step 3 — Thermal Preconditioning: The chuck table heats the wafer uniformly to the target
temperature (deviation ≤ ±1.5°C), while real-time sensors provide
feedback for automatic thermal drift correction — critical for
uniform underfill viscosity.
Step 4 — Visual Alignment: The 130W pixel camera with multi-spectrum illumination (red,
green, white combined) captures fiducial markers with ±1 pixel
accuracy across a 10×12mm field, mapping the exact position of
every die on the wafer.
Step 5 — Programmable Dispensing: Linear motor-driven X/Y axes (repeatability ±3μm) follow
user-defined dispensing paths at up to 1000mm/s. Dedicated
underfill valves deposit precise adhesive volumes tailored to each
bump pattern and fill depth.
Step 6 — Weighing Verification: An inline precision balance (0.01mg accuracy) periodically samples
dispensed glue weight, automatically feeding back corrections to
maintain shot-to-shot consistency within tight tolerances.
Step 7 — Wafer Unloading: After processing, the robot arm returns the wafer to its cassette
or FOUP. The entire cycle is tracked via video monitoring for full
process traceability and quality audit compliance.
About Mingseal
Mingseal is a trusted global manufacturer of advanced inline
dispensing and precision automation solutions. With a strong focus
on semiconductor, MEMS, optical, and microelectronics applications,
we deliver high-stability equipment and localized technical support
to help manufacturers worldwide achieve higher yield, greater
efficiency, and smarter production lines.
Contact us today to discuss your wafer-level underfill needs and experience the
Mingseal difference.
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