Class 10 Cleanroom RDL First WLP Underfill Advanced Packaging Wafer Level Dispensing Machine

The evolution of advanced semiconductor devices, such as 2.5D and fan-out wafer-level packaging, demands ultra-reliable underfill processes at the wafer stage. The SS101 is engineered to address these challenges by providing a highly stable dispensing environment within a controlled Class 10 cleanroom-compatible enclosure, supported by precise temperature management and real-time monitoring.

Equipped with an open communication protocol and compliant with international semiconductor ESD standards (IEC & ANSI), the SS101 seamlessly connects with existing factory information management systems — supporting modern smart fab and unmanned operation needs.

How It Works

The SS101 operates as a fully automated wafer-level underfill cell within a Class 10 cleanroom enclosure. The process begins at the Loadport where 12-inch FOUPs (or 8-inch open cassettes) are loaded. A robotic handling module transfers each wafer to the Aligner for precise orientation, then to the code scanning station for traceability. The wafer proceeds to the preheating station where it reaches the optimal temperature for underfill material flow. At the dual GS600SWA/SWB dispensing stations, the underfill material is precisely applied with ±10μm positioning accuracy. After dispensing, the wafer moves to the heat dissipation station for controlled cooling before robotic transfer back to the FOUP. The entire workflow is managed through an open communication protocol (SEMI-compliant) that integrates with fab MES/AMHS systems for full traceability and unmanned operation capability.

Core Advantages

• Optimized for Wafer-Level Underfill: Purpose-built for underfill and CUF processes in advanced fan-out and RDL First packaging scenarios.
• Fully Automated Workflow: Automatic wafer loading/unloading, alignment, preheating, dispensing, heat dissipation, and transfer between stations with robotic handling modules.
• Excellent Cleanroom Compatibility: Support Class 10 operation inside a Class 1000 fab environment.
• Precise Thermal Control: Maintain stable wafer temperatures during critical underfill operations, ensuring reliable flow, curing consistency, and minimal stress on bumps and micro-structures.

How to Choose

1. Cleanroom Classification — For RDL First and fan-out packaging, Class 10 (ISO Class 4) dispensing environment is critical to prevent particle contamination on exposed wafer surfaces.

2. Wafer Size Compatibility — The SS101 supports both 8-inch and 12-inch wafers. 12-inch FOUP is standard; confirm if 8-inch open cassette configuration is needed for legacy products.

3. Automation Level — Full robotic handling eliminates manual intervention, reducing contamination risk and enabling lights-out manufacturing.

4. Thermal Control — Integrated preheating and heat dissipation stations ensure consistent wafer temperature throughout the underfill process.

5. Fab Integration — SEMI-compliant communication protocols, AMHS interface readiness, and SECS/GEM support are essential for seamless integration into existing semiconductor fab infrastructure.

Application Areas

✔ RDL First Wafer-Level Packaging (WLP)
✔ Chip Underfill (CUF) Applications
✔ Advanced 2.5D and Fan-Out Packaging
✔ Wafer-Level CoWoS, FOPLP, and similar next-gen processes
✔ High-yield underfill lines for large-volume semiconductor fabs

System Composition

FAQ

Q1: What makes the SS101 different from standard dispensing systems?
A: Unlike general-purpose dispensers, the SS101 is specialized for wafer-level underfill with wafer alignment, preheating, and robotized transfer built in — ensuring uniform filling at micro-bump scales.

Q2: Can the SS101 handle both 8-inch and 12-inch wafers?
A: Yes — it is designed to support both sizes, with 12-inch FOUP compatibility as standard and optional 8-inch open cassette configuration.

Q3: How does the SS101 help reduce wafer contamination?
A: Its Class 10 dispensing zone and seamless robot handling minimize manual intervention, dust ingress, and ESD risk.

Q4: Is the SS101 easy to integrate into existing fabs?
A: Absolutely — it supports SEMI-compliant wafer readers, AMHS interfaces, and standard factory communication protocols.

About Mingseal

Mingseal is a globally recognized provider of high-precision dispensing, coating, and wafer-level fluid process solutions. We empower semiconductor, optical, and advanced packaging manufacturers with innovative automation equipment that drives yield, consistency, and smart factory goals. From high-volume wafer underfill to cutting-edge 2.5D integration, Mingseal delivers stable performance, local service, and trusted engineering support worldwide.

Contact Mingseal to discover how the SS101 Wafer-Level Dispensing Machine can take your advanced packaging capabilities to the next level.

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technology solutions for industry-leading customers in the fields of semiconductor packaging & testing and precision electronic manufacturing, jointly promoting industry technique and technology progress.

Mingseal Technology specializes in the development and production of high-precision dispensing machines, which are widely used in advanced semiconductor packaging, consumer electronics, and automotive electronics manufacturing. Our dispensing systems feature visual control, multi-axis motion, and adaptable configurations, enabling consistent and efficient material application in complex processes.

Our products are trusted by top-tier customers across industries, and our business and technical support network spans China, Japan, South Korea, Vietnam, Singapore, India, Thailand, Malaysia, and Mexico.

Mingseal Technology has received multiple national honors and qualifications, including National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise, and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, we will continue to invest in technological R&D, uphold values of cooperation and sharing, and work closely with customers, suppliers, employees, and partners to advance high-end intelligent manufacturing.