FS600A Dual-Track Underfill Dispensing Machine for Advanced Semiconductor Packaging

Inline Dual-Track Visual Dispensing Machine for Chip Underfill

The FS600 Series Inline Visual Dispensing Machine is an advanced high-efficiency dispensing solution engineered for chip underfill and electronic component assembly. Tailored to meet the rigorous precision and productivity demands of modern semiconductor packaging lines, this system integrates dual-track dual-station operation, enabling continuous inline dispensing on both boats simultaneously. Compared with single-track designs, this parallel production significantly boosts UPH and reduces idle time between workpieces.

Equipped with industry-leading features such as bottom heating, re-circulating dispensing, inline weight measurement, and an optional vacuum adsorption platform, the FS600 ensures excellent adhesive flow, stable dot size, and consistent bonding quality—even for tiny gap underfill and delicate components.

Core Advantages

• Dual-Track, Dual-Station Inline Design: Enables true parallel dispensing for high-volume SMT & chip underfill lines.
• Process Flexibility with Multiple Add-Ons: Optional bottom heating module ensures better adhesive wetting and flow for tight underfill gaps.
• Smart Visual Alignment: Positioning is auto-corrected in real time.
• High-Speed, Stable Production for Multiple Components: Ideal for microchips, BGA, CSP underfill, SMD bonding, and fine-pitch component reinforcement in SMT assembly lines.

Typical Applications

✔ Chip Underfill (BGA, CSP, Flip-Chip)
✔ SMD & Passive Component Bonding
✔ Micro-electronic module reinforcement
✔ PCB corner bonding & edge sealing
✔ Inline glue dot weight measurement and process monitoring
✔ Delicate substrate handling with vacuum adsorption

Technical Specifications

FAQ

Q1: What’s the advantage of dual-track, dual-station design?
A: Both boats can dispense independently at the same time, maximizing productivity and allowing different batches or recipes to run without downtime.

Q2: How does bottom heating improve underfill results?
A: Bottom heating keeps the board warm, lowering adhesive viscosity so the underfill can flow more easily into narrow chip gaps, reducing voids and improving bonding.

Q3: Why is inline weighing important?
A: Inline weighing continuously measures the actual glue output and automatically adjusts dispensing volume to stay within tight tolerances—helping you achieve zero-defect standards.

Q4: What if my boards are thin and easy to shift?
A: The vacuum adsorption module firmly holds the substrate flat and stable during high-speed dispensing, preventing micro-movement that could misalign the glue path.

How to Choose a Dual-Track Underfill Dispensing Machine

Selecting the right inline dispensing machine requires evaluating several critical factors that directly impact production yield and throughput:

1. Track Configuration — Single-track machines process one board at a time, while dual-track systems like the FS600A run two boats in parallel, effectively doubling throughput for high-volume SMT lines. Consider your target UPH and line balance when choosing between configurations.

2. Vision Alignment Accuracy — For fine-pitch components and small bump underfill, positioning accuracy of ±0.015mm or better is essential. Auto-correction capabilities ensure consistent placement even with slight board variations.

3. Heating and Temperature Control — Bottom heating modules improve adhesive flow into tight underfill gaps by reducing viscosity. For temperature-sensitive components, verify that heating uniformity stays within ±2°C across the entire substrate.

4. Inline Weighing and Process Control — Real-time weight measurement allows automatic volume correction, maintaining dispense consistency within microgram tolerances. This is critical for zero-defect manufacturing environments.

5. Substrate Handling — For thin or delicate boards, vacuum adsorption platforms prevent micro-movement during high-speed dispensing. Verify the maximum material dimensions (280mm x 180mm for FS600A) match your production requirements.

6. Maintenance and Serviceability — Easy-access valve cleaning, quick-change syringe systems, and modular design reduce downtime. Confirm local technical support availability and spare parts lead times.

How It Works: FS600A Dual-Track Dispensing Process

The FS600A operates through a fully automated inline dispensing workflow optimized for continuous production:

Step 1 — Board Loading: PCBs or substrates are conveyed into the machine on dual independent tracks. Each track can process a different product simultaneously, maximizing line utilization.

Step 2 — Visual Alignment: The 130W pixel camera system captures fiducial markers on each board, auto-correcting X/Y position and rotation in real time to ensure sub-pixel alignment accuracy.

Step 3 — Bottom Heating: Integrated heating modules warm the substrate to the optimal temperature, reducing underfill viscosity for better capillary flow into narrow chip-to-substrate gaps.

Step 4 — Programmed Dispensing: The dispensing head follows pre-programmed paths, depositing precise adhesive volumes with repeatability of ±0.01mm X/Y and ±0.015mm Z at speeds up to 1300mm/s.

Step 5 — Inline Weighing: After dispensing, an integrated precision scale measures the actual glue output weight, automatically feeding back corrections to maintain consistent shot volumes.

Step 6 — Board Unloading: Completed boards exit on the conveyor to the next SMT process station, while the next pair of boards enters for continuous parallel production.

About Mingseal

Mingseal is an industry leader specializing in precision dispensing solutions for semiconductor packaging, SMT assembly, MEMS, and advanced electronics manufacturing. With a full portfolio ranging from compact desktop systems to high-speed inline lines, we help factories worldwide achieve stable production, tight process control, and smart factory integration. Contact us to learn how our FS600 Series can drive your production to the next level.

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technology solutions for industry-leading customers in the fields of semiconductor packaging & testing and precision electronic manufacturing, jointly promoting industry technique and technology progress.

Mingseal Technology specializes in the development and production of high-precision dispensing machines, which are widely used in advanced semiconductor packaging, consumer electronics, and automotive electronics manufacturing. Our dispensing systems feature visual control, multi-axis motion, and adaptable configurations, enabling consistent and efficient material application in complex processes.

Our products are trusted by top-tier customers across industries, and our business and technical support network spans China, Japan, South Korea, Vietnam, Singapore, India, Thailand, Malaysia, and Mexico.

Mingseal Technology has received multiple national honors and qualifications, including National High-Tech Enterprise, National Intellectual Property Demonstration Enterprise, and National “Specialized, Fined, Peculiar and Innovative” Small Giant Enterprise. In the era of intelligence and digitalization, we will continue to invest in technological R&D, uphold values of cooperation and sharing, and work closely with customers, suppliers, employees, and partners to advance high-end intelligent manufacturing.