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Taconic RF-60A PCB 2-layer 50mil Laminate with Pure Gold Plating

Categories RF PCB Board
Brand Name: Bicheng
Model Number: BIC-200.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: RF-60A
Layer count: 2-layer
PCB thickness: 1.5mm
PCB size: 87mm x 29mm per unit, +/- 0.15mm
Copper weight: 1oz (1.4 mils) for outer layers
Surface finish: 100 uinch Pure Gold Plating
Solder mask: No
Silkscreen: No
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Taconic RF-60A PCB 2-layer 50mil Laminate with Pure Gold Plating

This 2-layer rigid printed circuit board (PCB) utilizes RF-60A as its core substrate and incorporates a 100 uinch Pure Gold Plating surface finish. Featuring a 1oz (1.4 mils) copper weight on the outer layers, a final board thickness of 1.5mm, and a via plating thickness of 20 μm, this PCB delivers consistent electrical performance and high-precision manufacturing standards, making it highly applicable for power amplifiers, filters, and other high-frequency electronic devices.


PCB Specifications

SpecificationsDetails
Base materialRF-60A
Layer count2 layers
Board dimensions87mm x 29mm per unit, +/- 0.15mm
Minimum Trace/Space5/6 mils
Minimum Hole Size0.4mm
Blind vias / buried viasBlind vias are not incorporated
Finished board thickness1.5mm
Finished Cu weight1 oz (1.4 mils) for outer layers
Via plating thickness20 μm
Surface finish100 uinch Pure Gold Plating
Top SilkscreenNot applied
Bottom SilkscreenNot applied
Top Solder MaskNot applied
Bottom Solder MaskNot applied
Quality control100% electrical testing is performed prior to shipment

PCB Stack-up

Stack-up LayerSpecification
Copper_layer_135 μm
RF-60A1.27 mm (50mil)
Copper_layer_235 μm


Artwork Type

The artwork provided for PCB fabrication adheres to the Gerber RS-274-X format, which serves as the industry-standard protocol for transmitting PCB manufacturing data.


Quality Standard

This PCB complies with the IPC-Class-2 standard, a widely recognized industry benchmark for printed circuit boards. IPC-Class-2 establishes requirements for PCB quality, performance, and reliability, rendering it suitable for the majority of commercial and industrial applications that require consistent performance and moderate reliability.


Availability

This PCB is available worldwide. We provide reliable logistics and shipping solutions to ensure prompt delivery to customers across various countries and regions, accommodating both small-batch and large-volume orders. Whether for regional electronic enterprises, research institutions, or global technology firms, we offer consistent supply and professional after-sales assistance to meet diverse market demands.


Introduction to RF-60A Base Material

RF-60A is an organic-ceramic laminate belonging to the ORCER product family by Taconic, featuring woven glass reinforcement. It is developed based on Taconic's expertise in both ceramic fill technology and coated PTFE fiberglass. RF-60A demonstrates exceptional interlaminar bond strength and solder resistance, with its proprietary composition ensuring low moisture absorption and uniform electrical properties. The woven glass reinforcement of RF-60A guarantees excellent dimensional stability and improves flexural strength, while its low Z-axis expansion ensures plated-through-hole reliability in extreme thermal environments.


Key Features of RF-60A

Key FeaturesSpecifications
Dielectric Constant (Dk)6.15 at 10 GHz
Dissipation Factor0.0038 at 10 GHz/23°C
Moisture Absorption0.02%
Thermal Conductivity0.4 W/MK
Coefficient of Thermal Expansion (CTE)9 ppm/°C (X-axis), 8 ppm/°C (Y-axis), 69 ppm/°C (Z-axis)
Outgassing0.02% TML, 0.01% WVR

Benefits

  • Compliant with RoHS and WEEE standards
  • Superior interlaminar bonding performance
  • Minimal moisture absorption
  • Enhanced dimensional stability
  • Low Z-axis expansion rate
  • Stable dielectric constant (DK) across frequency ranges
  • Improved flexural strength

Typical Applications

  • Power Amplifiers
  • Filters and Couplers
  • Miniaturized Antennas
  • Passive Components

Conclusion

This PCB is tailored for professionals, research and development (R&D) institutions, and technology enterprises engaged in the development and manufacturing of power amplifiers, filters, miniaturized antennas, and passive components. Leveraging the high-performance RF-60A substrate, this PCB serves as a reliable and high-quality solution for high-demand electronic applications requiring stable electrical performance and structural integrity.


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