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| Categories | Copper Clad Laminates |
|---|---|
| Brand Name: | Bicheng |
| Model Number: | BIC-332.V1.0 |
| Certification: | UL, ISO9001, IATF16949 |
| Place of Origin: | CHINA |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Payment Terms: | T/T |
| Supply Ability: | 5000PCS per month |
| Delivery Time: | 8-9 working days |
| Packaging Details: | Vacuum bags+Cartons |
| Part number: | CuClad 250 |
| Laminate thickness: | 0.254mm 0.508mm 0.787mm 1.575mm |
| Laminate size: | 18''X12''(457X305)18''X 24''(475 X 610mm) |
| Copper weight: | 0.5OZ(0.018MM), 1OZ(0.035mm); |
| Company Info. |
| Bicheng Electronics Technology Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
CuClad 250 laminates are woven fiberglass-reinforced PTFE composite materials engineered for deployment as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, CuClad 250 offers a versatile product portfolio—encompassing grades with ultra-low dielectric constant (Er) and loss tangent, to highly reinforced variants optimized for enhanced dimensional stability.
The woven fiberglass reinforcement integral to all CuClad series
materials delivers superior dimensional stability compared to
nonwoven fiberglass-reinforced PTFE laminates of equivalent
dielectric constant. Rogers’ stringent process control and
consistency for PTFE-coated fiberglass cloth enable a broader
spectrum of available Er values, while also producing laminates
with improved dielectric constant uniformity over comparable
nonwoven fiberglass-reinforced alternatives. These key performance
attributes position CuClad laminates as a high-value solution for
RF filters, couplers and low-noise amplifiers (LNAs).
A defining feature of CuClad laminates is their cross-plied
architecture: alternating layers of PTFE-coated fiberglass plies
are oriented at 90° to one another. This proprietary design
delivers true electrical and mechanical isotropy in the XY plane—a
unique performance characteristic exclusive to CuClad laminates,
unmatched by any other woven or nonwoven fiberglass-reinforced PTFE
laminate on the market. This exceptional level of isotropy has been
validated by designers as critical for demanding phased array
antenna applications.
With a dielectric constant (Er) range of 2.40–2.60, CuClad 250
utilizes a higher fiberglass-to-PTFE ratio to achieve mechanical
performance that approaches that of conventional PCB substrates.
Additional core benefits include enhanced dimensional stability and
reduced thermal expansion across all axes. For high-criticality
performance applications, CuClad products may be specified with the
LX testing grade—this designation ensures individual testing of
each sheet, with a formal test report included with the order.
LX-grade products carry a premium price point, as a section of each
sheet is used for destructive testing to validate performance.

Features & Benefits
Typical Applications
| Properties | Test Method | Condition | CuClad 250 |
| Dielectric Constant @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.40 to 2.55 |
| Dielectric Constant @1MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.40 to 2.60 |
| Dissipation Factor @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0017 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 (Adapted) | -10°C to +140°C | -153 |
| Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 8.0 x 10⁹ |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.5 x 10⁸ |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 725, 572 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 26.0, 20.5 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 342 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 456 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Specific Gravity (g/cm³) | ASTM D-792 (Method A) | A, 23°C | 2.31 |
| Water Absorption (%) | MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.03 |
| Coefficient of Thermal Expansion (ppm/°C) | IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer | 0°C to 100°C | X Axis: 18 |
| Y Axis: 28 | Y Axis: 24 | Y Axis: 19 | |
| Z Axis: 246 | Z Axis: 194 | Z Axis: 177 | |
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.25 |
| Outgassing Requirements | 125°C, ≤10⁻⁶ torr; NASA SP-R-0022A | - | |
| Total Mass Loss (%) | NASA SP-R-0022A (Maximum 1.00%) | 125°C, ≤10⁻⁶ torr | 0.01 |
| Collected Volatile Condensable Material (%) | NASA SP-R-0022A (Maximum 0.10%) | 125°C, ≤10⁻⁶ torr | 0.00 |
| Water Vapor Regain (%) | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | 0.00 |
| Visible Condensate (±) | NASA SP-R-0022A | 125°C, ≤10⁻⁶ torr | NO |
| Flammability | UL 94 Vertical Burn; IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |

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