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CuClad 250 PCB Substrate Copper Clad Laminate Sheet

Categories Copper Clad Laminates
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Part number: CuClad 250
Laminate thickness: 0.254mm 0.508mm 0.787mm 1.575mm
Laminate size: 18''X12''(457X305)18''X 24''(475 X 610mm)
Copper weight: 0.5OZ(0.018MM), 1OZ(0.035mm);
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CuClad 250 PCB Substrate Copper Clad Laminate Sheet

CuClad 250 laminates are woven fiberglass-reinforced PTFE composite materials engineered for deployment as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, CuClad 250 offers a versatile product portfolio—encompassing grades with ultra-low dielectric constant (Er) and loss tangent, to highly reinforced variants optimized for enhanced dimensional stability.


The woven fiberglass reinforcement integral to all CuClad series materials delivers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency for PTFE-coated fiberglass cloth enable a broader spectrum of available Er values, while also producing laminates with improved dielectric constant uniformity over comparable nonwoven fiberglass-reinforced alternatives. These key performance attributes position CuClad laminates as a high-value solution for RF filters, couplers and low-noise amplifiers (LNAs).


A defining feature of CuClad laminates is their cross-plied architecture: alternating layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This proprietary design delivers true electrical and mechanical isotropy in the XY plane—a unique performance characteristic exclusive to CuClad laminates, unmatched by any other woven or nonwoven fiberglass-reinforced PTFE laminate on the market. This exceptional level of isotropy has been validated by designers as critical for demanding phased array antenna applications.


With a dielectric constant (Er) range of 2.40–2.60, CuClad 250 utilizes a higher fiberglass-to-PTFE ratio to achieve mechanical performance that approaches that of conventional PCB substrates. Additional core benefits include enhanced dimensional stability and reduced thermal expansion across all axes. For high-criticality performance applications, CuClad products may be specified with the LX testing grade—this designation ensures individual testing of each sheet, with a formal test report included with the order. LX-grade products carry a premium price point, as a section of each sheet is used for destructive testing to validate performance.



Features & Benefits

  • Cross-plied woven fiberglass architecture with alternating plies oriented at 90°
  • High PTFE-to-glass ratio
  • Superior dielectric constant uniformity vs. comparable nonwoven fiberglass-reinforced laminates
  • True electrical and mechanical isotropy in the XY plane
  • Ultra-low signal loss
  • Ideal for dielectric constant (Er)-sensitive circuit designs


Typical Applications

  • Military electronics systems (radars, electronic countermeasures [ECM], electronic support measures [ESM])
  • Microwave components (low-noise amplifiers [LNAs], filters, couplers, etc.)

PropertiesTest MethodConditionCuClad 250
Dielectric Constant @10 GHzIPC TM-650 2.5.5.5C23/502.40 to 2.55
Dielectric Constant @1MHzIPC TM-650 2.5.5.3C23/502.40 to 2.60
Dissipation Factor @10 GHzIPC TM-650 2.5.5.5C23/500.0017
Thermal Coefficient of Er (ppm/°C)IPC TM-650 2.5.5.5 (Adapted)-10°C to +140°C-153
Peel Strength (lbs.per inch)IPC TM-650 2.4.8After Thermal Stress14
Volume Resistivity (MΩ-cm)IPC TM-650 2.5.17.1C96/35/908.0 x 10⁹
Surface Resistivity (MΩ)IPC TM-650 2.5.17.1C96/35/901.5 x 10⁸
Arc Resistance (seconds)ASTM D-495D48/50>180
Tensile Modulus (kpsi)ASTM D-638A, 23°C725, 572
Tensile Strength (kpsi)ASTM D-882A, 23°C26.0, 20.5
Compressive Modulus (kpsi)ASTM D-695A, 23°C342
Flexural Modulus (kpsi)ASTM D-790A, 23°C456
Dielectric Breakdown (kV)ASTM D-149D48/50>45
Specific Gravity (g/cm³)ASTM D-792 (Method A)A, 23°C2.31
Water Absorption (%)MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2E1/105 + D24/230.03
Coefficient of Thermal Expansion (ppm/°C)IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer0°C to 100°CX Axis: 18
Y Axis: 28Y Axis: 24Y Axis: 19
Z Axis: 246Z Axis: 194Z Axis: 177
Thermal Conductivity (W/mK)ASTM E-1225100°C0.25
Outgassing Requirements125°C, ≤10⁻⁶ torr; NASA SP-R-0022A-
Total Mass Loss (%)NASA SP-R-0022A (Maximum 1.00%)125°C, ≤10⁻⁶ torr0.01
Collected Volatile Condensable Material (%)NASA SP-R-0022A (Maximum 0.10%)125°C, ≤10⁻⁶ torr0.00
Water Vapor Regain (%)NASA SP-R-0022A125°C, ≤10⁻⁶ torr0.00
Visible Condensate (±)NASA SP-R-0022A125°C, ≤10⁻⁶ torrNO
FlammabilityUL 94 Vertical Burn; IPC TM-650 2.3.10C48/23/50, E24/125Meets requirements of UL94-V0

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