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DiClad 527 PCB Substrate Copper Clad Laminate Sheet

Categories Copper Clad Laminates
Brand Name: Bicheng
Model Number: BIC-332.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Part number: DiClad 527
Laminate thickness: 0.508mm 0.762mm 1.524mm
Laminate size: 12''X18''(305X457mm) 18''X12''(457X305)18''X 24''(475 X 610mm)24''X18''(610X457mm)
Copper weight: 0.5OZ(0.018MM), 1OZ(0.035mm);
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DiClad 527 PCB Substrate Copper Clad Laminate Sheet

DiClad 527 laminates are woven fiberglass-reinforced PTFE composite materials engineered for use as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, DiClad 527 offers a versatile product range—spanning variants with ultra-low dielectric constant (Dk) and dissipation factor (Df), to highly reinforced grades optimized for enhanced dimensional stability.


The woven fiberglass reinforcement core to all DiClad series materials delivers superior dimensional stability when compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent process control and consistency for PTFE-coated fiberglass cloth enable a broader spectrum of available Dk values, while also producing laminates with improved dielectric constant uniformity over comparable nonwoven fiberglass-reinforced alternatives. DiClad materials feature unidirectionally aligned coated fiberglass plies; cross-plied configurations of most grades are available under the CuClad product line.


DiClad 527 laminates are ideally suited for applications where dielectric constant uniformity is a critical performance parameter, including RF filters, couplers, and low-noise amplifiers (LNAs). They are also a high-value choice for power dividers and combiners, where minimal signal loss is paramount. With a dielectric constant (Er) range of 2.40–2.65, DiClad 527 utilizes a higher fiberglass-to-PTFE ratio to achieve mechanical performance that approaches conventional PCB substrates—alongside additional advantages of enhanced dimensional stability and reduced thermal expansion across all axes. The electrical properties of DiClad 527 laminates are validated through rigorous testing at 1 MHz and 10 GHz, respectively.



Features & Benefits

  • Ultra-low loss tangent
  • Exceptional dimensional stability
  • Consistent product performance
  • Highly uniform electrical properties across the operating frequency range
  • Reliable, repeatable mechanical performance
  • Superior chemical resistance


Typical Applications

  • Military radar feed networks
  • Commercial phased array antenna networks
  • Low-loss base station antennas
  • Missile guidance systems
  • Digital radio antennas
  • RF filters, couplers, and low-noise amplifiers (LNAs)

PropertiesDiClad 527UnitsTest ConditionsTest Method
Electrical Properties----
Dielectric Constant (10 GHz)2.40-2.60-23˚C @ 50% RH 10 GHzIPC TM-650 [2.5.5.5](2.5.5.5)
Dielectric Constant (1 MHz)2.40-2.60-23˚C @ 50% RH 1 MHzIPC TM-650 [2.5.5.3](2.5.5.3)
Dissipation Factor (10 GHz)0.0017-23˚C @ 50% RH 10 GHzIPC TM-650 [2.5.5.5](2.5.5.5)
Dissipation Factor (1 MHz)0.0010-23˚C @ 50% RH 1 MHzIPC TM-650 [2.5.5.3](2.5.5.3)
Thermal Coefficient of Dielectric Constant-153ppm/˚C-10 to 140˚C 10 GHzIPC TM-650 [2.5.5.5](2.5.5.5)
Volume Resistivity1.2 x 10⁹MΩ-cmC96/35/90IPC TM-650 [2.5.17.1](2.5.17.1)
Surface Resistivity4.5 x 10⁷C96/35/90IPC TM-650 [2.5.17.1](2.5.17.1)
Dielectric Breakdown>45kVD48/50ASTM D-149
Arc Resistance>180--ASTM D-495
Thermal Properties----
Coefficient of Thermal Expansion - x14ppm/˚C-50˚C to 150˚CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - y21ppm/˚C-50˚C to 150˚CIPC TM-650 2.4.41
Coefficient of Thermal Expansion - z173ppm/˚C-50˚C to 150˚CIPC TM-650 2.4.24
Thermal Conductivity0.26W/(m.K)-ASTM E1461
Mechanical Properties----
Copper Peel Strength14Lbs/in10s @288˚C 35 μm foilIPC TM-650 2.4.8
Young’s Modulus517, 706kpsi23˚C @ 50% RHASTM D-638
Tensile Strength (MD, CMD)19.0, 15.0kpsi23˚C @ 50% RHASTM D-882
Compressive Modulus359kpsi23˚C @ 50% RHASTM D-695
Flex Modulus537kpsi23˚C @ 50% RHASTM D-3039
Physical Properties----
FlammabilityV-0-C48/23/50 & C168/70UL 94
Moisture Absorption0.03%E1/105+D24/23IPC TM-650 [2.6.2.2](2.6.2.2)
Density2.31g/cm³C24/23/50 Method AASTM D792
NASA Outgassing----
Total Mass Lost0.02%125°C, ≤ 10⁻⁶ torrNASA SP-R-0022A
Collected Volatiles0.00%125°C, ≤ 10⁻⁶ torrNASA SP-R-0022A
Water Vapor Recovered0.01%125°C, ≤ 10⁻⁶ torrNASA SP-R-0022A

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