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| Categories | Copper Clad Laminates |
|---|---|
| Brand Name: | Bicheng |
| Model Number: | BIC-332.V1.0 |
| Certification: | UL, ISO9001, IATF16949 |
| Place of Origin: | CHINA |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Payment Terms: | T/T |
| Supply Ability: | 5000PCS per month |
| Delivery Time: | 8-9 working days |
| Packaging Details: | Vacuum bags+Cartons |
| Part number: | DiClad 527 |
| Laminate thickness: | 0.508mm 0.762mm 1.524mm |
| Laminate size: | 12''X18''(305X457mm) 18''X12''(457X305)18''X 24''(475 X 610mm)24''X18''(610X457mm) |
| Copper weight: | 0.5OZ(0.018MM), 1OZ(0.035mm); |
| Company Info. |
| Bicheng Electronics Technology Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
DiClad 527 laminates are woven fiberglass-reinforced PTFE composite materials engineered for use as high-performance printed circuit board (PCB) substrates. Through precise calibration of the fiberglass-to-PTFE ratio, DiClad 527 offers a versatile product range—spanning variants with ultra-low dielectric constant (Dk) and dissipation factor (Df), to highly reinforced grades optimized for enhanced dimensional stability.
The woven fiberglass reinforcement core to all DiClad series
materials delivers superior dimensional stability when compared to
nonwoven fiberglass-reinforced PTFE laminates of equivalent
dielectric constant. Rogers’ stringent process control and
consistency for PTFE-coated fiberglass cloth enable a broader
spectrum of available Dk values, while also producing laminates
with improved dielectric constant uniformity over comparable
nonwoven fiberglass-reinforced alternatives. DiClad materials
feature unidirectionally aligned coated fiberglass plies;
cross-plied configurations of most grades are available under the
CuClad product line.
DiClad 527 laminates are ideally suited for applications where
dielectric constant uniformity is a critical performance parameter,
including RF filters, couplers, and low-noise amplifiers (LNAs).
They are also a high-value choice for power dividers and combiners,
where minimal signal loss is paramount. With a dielectric constant
(Er) range of 2.40–2.65, DiClad 527 utilizes a higher
fiberglass-to-PTFE ratio to achieve mechanical performance that
approaches conventional PCB substrates—alongside additional
advantages of enhanced dimensional stability and reduced thermal
expansion across all axes. The electrical properties of DiClad 527
laminates are validated through rigorous testing at 1 MHz and 10
GHz, respectively.

Features & Benefits
Typical Applications
| Properties | DiClad 527 | Units | Test Conditions | Test Method |
| Electrical Properties | - | - | - | - |
| Dielectric Constant (10 GHz) | 2.40-2.60 | - | 23˚C @ 50% RH 10 GHz | IPC TM-650 [2.5.5.5](2.5.5.5) |
| Dielectric Constant (1 MHz) | 2.40-2.60 | - | 23˚C @ 50% RH 1 MHz | IPC TM-650 [2.5.5.3](2.5.5.3) |
| Dissipation Factor (10 GHz) | 0.0017 | - | 23˚C @ 50% RH 10 GHz | IPC TM-650 [2.5.5.5](2.5.5.5) |
| Dissipation Factor (1 MHz) | 0.0010 | - | 23˚C @ 50% RH 1 MHz | IPC TM-650 [2.5.5.3](2.5.5.3) |
| Thermal Coefficient of Dielectric Constant | -153 | ppm/˚C | -10 to 140˚C 10 GHz | IPC TM-650 [2.5.5.5](2.5.5.5) |
| Volume Resistivity | 1.2 x 10⁹ | MΩ-cm | C96/35/90 | IPC TM-650 [2.5.17.1](2.5.17.1) |
| Surface Resistivity | 4.5 x 10⁷ | MΩ | C96/35/90 | IPC TM-650 [2.5.17.1](2.5.17.1) |
| Dielectric Breakdown | >45 | kV | D48/50 | ASTM D-149 |
| Arc Resistance | >180 | - | - | ASTM D-495 |
| Thermal Properties | - | - | - | - |
| Coefficient of Thermal Expansion - x | 14 | ppm/˚C | -50˚C to 150˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 21 | ppm/˚C | -50˚C to 150˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 173 | ppm/˚C | -50˚C to 150˚C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.26 | W/(m.K) | - | ASTM E1461 |
| Mechanical Properties | - | - | - | - |
| Copper Peel Strength | 14 | Lbs/in | 10s @288˚C 35 μm foil | IPC TM-650 2.4.8 |
| Young’s Modulus | 517, 706 | kpsi | 23˚C @ 50% RH | ASTM D-638 |
| Tensile Strength (MD, CMD) | 19.0, 15.0 | kpsi | 23˚C @ 50% RH | ASTM D-882 |
| Compressive Modulus | 359 | kpsi | 23˚C @ 50% RH | ASTM D-695 |
| Flex Modulus | 537 | kpsi | 23˚C @ 50% RH | ASTM D-3039 |
| Physical Properties | - | - | - | - |
| Flammability | V-0 | - | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.03 | % | E1/105+D24/23 | IPC TM-650 [2.6.2.2](2.6.2.2) |
| Density | 2.31 | g/cm³ | C24/23/50 Method A | ASTM D792 |
| NASA Outgassing | - | - | - | - |
| Total Mass Lost | 0.02 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
| Collected Volatiles | 0.00 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
| Water Vapor Recovered | 0.01 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |

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