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JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes

Categories JEDEC IC Trays
Cavity Size: 18.5×11.6×4.26 mm
Model Number: HN25083
Reusable: Yes
Payment Terms: T/T
Color: Black
Incoterms: EXW, FOB, CIF, DDU, DDP
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Quality Assurance: Delivery Guarantee, Reliable Quality
Supply Ability: 2000PCS/Day
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
MOQ: 500 pcs
Delivery Time: 10 workdays
Mold Type: Injection
Clean Class: General And Ultrasonic Cleaning
Brand Name: Hiner-pack
Tray Shape: Rectangular
Packaging Details: CARTON, PALLET
Place of Origin: China
Ic Type: BGA,QFP,QFN,LGA,PGA
Certification: ROHS, ISO
Packing Level: Transport package
Flatness: Less than 0.76mm
Capacity: 20x5=100 PCS
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  • Product Details
  • Company Profile

JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes

JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes

Constructed from high‑performance Mppo material, hold integrated circuit parts securely. Resist high operating heat and block outside contaminants. Maintain stable performance through repeated circulation inside semiconductor workshops.


Meet diverse chip layout requirements. Custom cavity development serves as core offering. Adjust cavity dimension, slot quantity and overall tray outline to match varied chip samples and project standards.


Fit mainstream semiconductor production workflows. Keep steady supporting performance for long‑time mass‑use. Bring consistent protection from component loading all the way to finished‑part outgoing shipment.

Key Features/ Benefits
  • Excellent high‑temperature resistance
  • Dust reduction and anti-contamination
  • Support full cavity custom development
  • Secure component retention
  • Durable for repeated circulation
Specifications
BrandHiner-pack
ModelHN25083
MaterialMPPO
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6×135.9×9.5 mm
Cavity Size18.5×11.6×4.26 mm
Matrix QTY20x5=100 PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications

Suit semiconductor chip packaging and assembly workflows. Hold integrated circuit components steady during automated production operations.

Fit bulk component storage and inter‑workshop transit. Protect delicate chips against dust and scratch. Accept custom modification for special non‑standard chip types.

Packaging & Shipping/ Services

Get stacked with separating protective boards, then packed into thick carton cases. Lower scratch and collision risks during inner‑site handling.


Support sea, air and express delivery modes. Arrange stable production lead‑time. Adopt reinforced outer package to reduce damage risk for long‑distance overseas shipment.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
Buy JEDEC IC Trays Protect Semiconductor Components In Packaging And Assembly Processes at wholesale prices
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