3M 8444-21A1-RK-TP

Product Overview

The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular applications. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are compatible with automated loading equipment. The open-top design allows for unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are available. These sockets are RoHS Compliant.

Product Attributes

• Brand: 3M
• Product Line: 3M Chip Carrier Sockets
• Series: 8400 Series
• Mounting Type: Surfacemount
• Insulation Material: Glass Filled Polyphenylene Sulfide (PPS)
• Flammability: UL 94V-0
• Color: Black
• Contact Material: Copper Alloy
• Underplating: 50 " [ 1.27 m ] Nickel
• Wiping Area Plating: 160 ", [ 4.06 m ] Matte Tin
• Certifications: RoHS Compliant (RIA E1 and C1 apply)
• Packaging Options: Tube Pack (TP), Tape and Reel (TR)

Technical Specifications

Ordering Information

Note on Tin Plating: 3M PLCC products are tin plated on the contact wiping surface. This is necessary for mated reliability. Tin whiskers are an inherent characteristic of tin, and mechanical stress can drive whisker growth. It is possible for PLCC and PLCC sockets to exhibit tin whisker growth after mating. 3M follows iNEMI plating recommendations with whisker-mitigating tin plating chemistry to reduce the likelihood of growth. Evaluate suitability based on product application lifespan, environment, mechanical stresses, humidity, and thermal cycling.

Contact Quantity and Dimensions (mm [Inch]):

Alignment Feature:

• A = With Location Post (tube packaging only)
• B = Without Location Post

Packaging:

• TP = Tube Pack
• TR = Tape and Reel (Contact 3M for dimensions)

Tolerance: Unless Noted: .3 mm, .20 [ ] Dimensions for Reference Only