GC5035 RGB Rolling Shutter MIPI Camera Module 2592x1944 For Barcode Scanning

GC GC5035 RGB Rolling Shutter Camera Module , Machine Vision , Biometrics , QR Code , Customization Services Available .

1. Basic Parameters:

- Resolution: 2592 (H) × 1944 (V), 5 MP; delivers clear and smooth image quality, meeting daily basic imaging needs.
- Pixel dimensions: 1.12 μm (H) × 1.12 μm (V), featuring a back-side illumination (BSI) pixel design with an optimized light-sensitive area that significantly enhances light sensitivity and imaging detail, achieving both compact size and high-definition performance.
- Optical format: 1/5 inch, compatible with various compact lens modules, offering strong adaptability to meet the lens installation requirements of slim and lightweight devices.
- Power Supply Voltage: The core voltage is 1.2 V, the interface voltage is 1.8 V, and the analog voltage is 2.8 V, ensuring stable operation under various voltage conditions and guaranteeing sensor reliability.

- Temperature Range: Operating temperature ranges from-30°C to 70°C, providing a wide operational temperature range suitable for diverse working environments.

2. Technical Features:

- Rolling shutter technology: Utilizes a rolling shutter design with sequential exposure, delivering low image noise and fine detail reproduction, along with high circuit integration, optimized power consumption, and cost efficiency, making it ideal for high-definition imaging in static or low-speed scenarios. - Built-in 10-bit high-precision on-chip ADC paired with an optimized image processing module, offering a high dynamic range of 64.7 dB and a signal-to-noise ratio of 37 dB, with dark current as low as 3 μA/s (at 60°C), effectively suppressing image noise and enhancing depth perception. The sensor employs an RGB Bayer color array for precise color reproduction, supports horizontal and vertical mirror imaging, accommodates various installation configurations and viewing angles, and delivers clear, detailed images under diverse lighting conditions.
- Supports multiple packaging formats including COB, CSP, and COM, featuring compact size that accommodates thin-and-light, miniaturized module designs. It flexibly adapts to equipment structures of various dimensions, balancing product miniaturization with performance stability while meeting diverse hardware integration requirements.
- GC5035 Camera Module: Compatible with standard modules for various lens configurations (including 74mm), meeting diverse customer requirements.

3. Application Fields:

Used in biometrics, drones, smart homes, IoT devices, machine vision, barcode scanning, factory automation, and related applications.

4. Personalized Customization Service:

All customized modules can be manufactured according to specific client specifications, delivering tailored solutions that meet unique needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.