S5K2P7 RGB Rolling Shutter MIPI Camera Module 4656x3496 for Machine Vision

S5K2P7 RGB Rolling Shutter Camera Module , Machine Vision , Biometrics , QR Code , Customization Services Available .

1.Basic Parameters:

- Resolution: 4656 (H) × 3496 (V), 16 MP, delivering exceptional image clarity that accurately captures scene details and textures, meeting daily high-definition imaging requirements.
- Pixel dimensions: 1.12 µm (H) × 1.12 µm (V). The moderate pixel sensitivity area balances high pixel resolution with optimal light sensitivity, effectively enhancing image uniformity, reducing noise, and ensuring fundamental image quality.
- Optical format: 1/2.8-inch, featuring a compact and lightweight sensor that suits various miniaturized and lightweight designs with exceptional compatibility.
- Power supply voltage: The core voltage is 1.0 V, the interface voltage is 1.8 V, and the analog voltage is 2.8 V, enabling stable operation under various voltage conditions and ensuring sensor reliability.

- Temperature range: The operating temperature spans from-30°C to 70°C, offering a wide temperature range suitable for diverse operating environments.

2.Technical Features:

- Curtain shutter technology: Utilizes a curtain shutter design with sequential exposure, delivering low imaging noise and fine detail reproduction, along with high circuit integration, optimized power consumption, and cost efficiency—ideal for high-definition imaging in static or low-speed scenarios.

- Features superior light sensitivity and low-noise imaging technology, achieving a sensitivity of up to 3300 mV/lux·sec. This exceptional sensitivity enables efficient capture of ambient light, resulting in transparent images and precise color reproduction under standard lighting conditions. The technology also incorporates a low dark current process, controlling dark current at 10 nA/cm², which significantly reduces image noise in low-light environments, enhances low-light imaging quality, maintains depth of field in bright scenes, and prevents overexposure artifacts.
- The ISOCELL pixel isolation technology effectively suppresses inter-pixel crosstalk through its physical isolation structure, significantly improving imaging defects such as color dispersion, edge blurring, and color crosstalk. This enhances image clarity and color purity, delivering sharper details and more authentic colors, with superior stability in dynamic scenes. Supporting wide-field-of-view imaging, it delivers high precision for capturing mobile subjects and rapidly moving objects while minimizing motion blur and frame lag, making it ideal for real-time surveillance applications with stable frame rates and seamless image continuity.
- S5K2P7 Camera Module: Compatible with various lens configuration standards including 78, meeting diverse customer requirements.

3.Application Fields:

Used in biometrics, drones, smart homes, IoT devices, machine vision, barcode scanning, factory automation, and other applications.

4.Personalized Customization Services:

The modular design enables tailored production based on customer specifications, delivering customized solutions that meet specific needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.