ST VD16GZ RGB IR Global Shutter Camera Module for AR / VR Customized

ST VD16GZ RGB - IR Global Shutter Camera Module , Machine Vision , AR / VR , QR Code , Customization Services Available .

1. Basic parameters:

- Resolution: 1124 (H) x 1364 (V), 1.53MP uses excellent 3D stacking and STMicroelectronics patented process, and performs well in the visible light and near-infrared regions (850 nm or 940 nm).

- Pixel size: 2.61μm (H) × 2.61μm (V), combining the three advantages of low parasitic sensitivity (PLS), high quantum efficiency (QE) and low crosstalk.

- Optical format: 1/4 inch, this size of optical format ensures a certain light collection capacity while also making the sensor suitable for a variety of miniaturized devices.

- Power supply voltage: The core voltage is 1.15V, the interface voltage is 1.8V, and the analog voltage is 2.8V. It can work stably under different voltage conditions, ensuring the reliability of the sensor.

- Temperature range: The operating temperature is -30℃ to 85℃, with a wide temperature operating range, which can adapt to different working environments.

2. Technical features:

- Global shutter technology: The global shutter design effectively eliminates motion blur and lighting artifacts, while reducing lighting power consumption requirements.

- Full pixel packaging technology is used to provide excellent photosensitivity and image sharpness in the visible to near-infrared spectrum range (such as 850 nm or 940 nm), and the ability to capture details is unparalleled.

- It adopts the self-developed BSI back-illuminated structure by STMicroelectronics to boost the quantum efficiency (QE), modulation transfer function (MTF) and oblique incident light response capability, greatly improving the imaging performance under low-light conditions.

- The VD16GZ RGB-IR image sensor has three versions: 1.5 million pixel RGB version (VD66GY), 1.5 million pixel Mono version (VD56G3).

- VD16GZ camera module: compatible with standard modules with different lens configurations such as 152° and 73°; meet different customer needs.

3. Application areas:

Used in virtual reality/augmented reality, biometrics, drones, smart homes, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

4. Personalized customization service:

Customized modules can be customized according to customer needs, and tailor-made products that meet customers' needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.