Global Shutter 49 Perspective MIPI Camera Module 1.53 MP With VD56G3CCA Sensor

1.53 MP MONO Global Shutter 49 Perspective MIPI Camera Module With VD56G3CCA Sensor , Customization Services Available .

1.Basic Parameters:

- Resolution: 1124 (H) × 1346 (V), 1.53 MP, delivering precise capture of HD image details while balancing imaging accuracy and transmission efficiency, suitable for various machine vision HD acquisition scenarios.
- Pixel dimensions: 2.61 μm (H) × 2.61 μm (V). The small-pixel design enables a compact sensor layout while maintaining excellent light sensitivity and image clarity, achieving an optimal balance between device size and imaging quality.
- Optical format: 1/4 inch, featuring compact dimensions ideal for miniaturized module designs.
- Power Supply Voltage: The core voltage is 1.15 V, the interface voltage is 1.8 V, and the analog voltage is 2.8 V, ensuring stable operation under various voltage conditions and guaranteeing sensor reliability.

- Temperature Range: Operating temperature ranges from-30°C to 85°C, offering a wide operational temperature range suitable for diverse working environments.

2.Technical Features:

- Global shutter technology: The global shutter design effectively eliminates motion blur and lighting artifacts while reducing power consumption.

- Utilizing a backlit (BSI) optical architecture combined with a global shutter imaging solution, along with 3D stacking technology and CDTI continuous digital time-integration technology, it significantly enhances light utilization efficiency, delivers excellent imaging performance in low-light conditions, and effectively reduces image noise and ghosting effects.
- Equipped with multiple built-in image optimization algorithms and data processing modules, it supports advanced image processing functions including automatic exposure adjustment, bad pixel correction, pixel merging, image cropping, and subsampling scaling. The system autonomously performs adaptive brightness adjustment and defect pixel repair, while allowing flexible customization of image size and resolution without requiring additional external image processing chips, thereby significantly reducing overall power consumption and hardware costs while enhancing imaging calibration efficiency.
- VD56G3CCA Camera Module: Compatible with standard modules for various lens configurations including 49mm, meeting diverse customer requirements.

3. Application Areas:

Used in virtual reality/augmented reality, biometrics, drones, smart homes, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation, and other fields.

4. Personalized Customization Service:

All customized modules can be manufactured according to specific client needs, delivering tailored solutions that meet individual requirements.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.