SC SC223A Rolling Shutter RGB Camera Module 2.9μM X 2.9μM Pixel 2MP

SC SC223A RGB Rolling Shutter Camera Module , Machine Vision , Biometrics , QR Code , Customization Services Available .

1. Basic Parameters:

- Resolution: 1920 (H) × 1080 (V), 2MP. It can capture detailed information clearly and meet the demand for high-definition imaging.

- Pixel Size: 2.9µm (H) × 2.9µm (V). The optimized pixel design combined with innovative processes effectively increases light intake, laying a foundation for clear imaging in low-light environments.

- Optical Format: 1/2.8 inch. It is compatible with a variety of common lenses, features good compatibility, and can be flexibly applied to the design of terminal products in different forms.

- Supply Voltage: Core voltage 1.2V, interface voltage 1.8V, analog voltage 2.8V. It can operate stably under different voltage conditions and ensure the reliability of the sensor.

- Temperature Range: Operating temperature ranges from -30℃ to 85℃. It has a wide operating temperature range and can adapt to various working environments.

2. Technical Features:

- Rolling Shutter Technology: Adopting a progressive exposure rolling shutter design, it delivers low imaging noise and delicate detail restoration. With high circuit integration, it achieves better power consumption and cost performance, suitable for high-definition imaging in static and low-speed scenarios.

- Equipped with DSI-2 imaging technology, its sensitivity is increased by 20% compared with the previous DSI-1 products. It has excellent full-color night vision imaging capability in low-light environments, can effectively capture details in dim scenes, avoid blurry images and excessive noise, and achieve clear night imaging effects.

- Integrated with PixGain™ technology, the full-well electron capacity is more than doubled, greatly improving the dynamic range and maximum signal-to-noise ratio of daytime imaging. In well-lit scenarios, it can present vivid colors and rich details, realizing dual upgrades of imaging performance both day and night. It adopts 41-pin CSP packaging with a package size of only 6.17mm x 4.13mm. Its compact size meets the design requirements of miniaturized terminal products while maintaining good structural stability.

- SC223A Camera Module: Compatible with standard modules with different lens configurations such as 130° to meet diverse customer needs.

3. Application Fields:

Applied in biometric recognition, drones, smart home, IoT devices, machine vision, barcode scanning, factory automation and other fields.

4. Personalized Customization Services:

Custom modules can be produced tailor-made according to customer requirements, delivering customized products that perfectly match customers' demands.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.