GC0310 RGB Rolling Shutter Camera Sensor Module 648x488 for QR Code

GC GC0310 RGB Rolling Shutter Camera Module , Machine Vision , Biometrics , QR Code , Customization Services Available .

1.Basic Parameters:

- Resolution: 648 (H) × 488 (V), 0.3 MP; delivers clear and balanced imaging quality that meets the visual requirements of mainstream lightweight imaging devices, fulfilling fundamental needs for daily high-definition framing and image capture.
- Pixel dimensions: 2.25 μm (H) × 2.25 μm (V); the pixels are arranged in a regular pattern with optimized sensor unit placement, ensuring stable image quality within the compact chip size while balancing imaging performance with device miniaturization requirements.
- Optical format: 1/10 inch; the compact overall image sensor chip is designed for compatibility with miniature lens modules, meeting the assembly requirements of various small and micro imaging devices with excellent spatial adaptability.
- Power Supply Voltage: The interface voltage is 1.8 V, and the analog voltage is 2.8 V, ensuring stable operation under various voltage conditions and guaranteeing sensor reliability.

- Temperature Range: Operating temperature ranges from –20°C to 70°C, providing a wide operational temperature range suitable for diverse working environments.

2.Technical Features:

- Rolling shutter technology: Utilizes a rolling shutter design with sequential exposure, delivering low image noise and fine detail reproduction, along with high circuit integration, optimized power consumption, and reduced cost, making it ideal for high-definition imaging in static or low-speed scenarios.

- Advanced 4T four-transistor pixel architecture: While minimizing chip area, it significantly enhances light sensitivity performance, effectively reduces image noise, suppresses color artifacts and graininess, resulting in clean and clear images. Compared to traditional pixel architectures, this design offers higher photoelectric conversion efficiency, ensures clear image quality even in low-light conditions, and balances image quality with chip miniaturization advantages.
- Equipped with intelligent imaging adjustment features such as automatic exposure, white balance, and gain control, it dynamically optimizes image parameters in real time based on ambient light intensity and color temperature variations, effectively addressing issues like overexposure in bright conditions, underexposure in low-light environments, and color distortion. This ensures consistent high-quality images without manual adjustments.
- GC0310 Camera Module: Compatible with standard modules for various lens configurations (including 62mm), meeting diverse customer requirements.

3. Application Areas:

Used in biometrics, drones, smart homes, IoT devices, machine vision, barcode scanning, factory automation, and related fields.

4. Personalized Customization Service:

All customized modules can be manufactured according to specific client specifications, delivering tailored solutions that meet unique needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.