2.4KW Heat Source Liquid Cooling Plate Charging Stack Thermal System

Fully liquid-cooled charging stack system with advanced 2.4KW heat source power designed for ultra-fast charging applications. Comprehensive solution composed of radiators, circulating pumps, make-up pumps, water tanks, sensors, fans and control systems.

• Application: Liquid-cooled ultra-fast charging terminals

• Liquid-cooled gun current: 600A to 800A (5m-7m charging cable, 600A for single gun)
• Heat source power: 2.4KW
• Coolant type: Ethylene glycol solution or silicone oil
• Operating environment temperature: -40°C to 55°C
• Input voltage: 24V DC; Input current: ≤10A; Flow rate: 0 to 5L/min
• Communication: 485 (Modbus RTU protocol)
• Noise level: ≤60dB
• Ambient temperature: -30°C to 55°C
• Humidity: 5% to 90%
• Altitude: ≤2000m
• Unit dimensions: 380×220×550mm (W×L×H)

Custom internal flow channel design based on customer power consumption data and heat distribution patterns. Our engineering process includes comprehensive simulation analysis with iterative parameter adjustments to achieve optimal thermal and hydraulic performance targets.

Our vacuum brazing process joins aluminum plates using filler metal with lower melting points than the base material, creating extremely strong joints without residual corrosive flux. This high-end technology provides uniform heating, precise temperature control, eliminates post-cleaning requirements, and minimizes part distortion.

High-power liquid cooling systems require heat sinks capable of rapid heat absorption. Leveraging the high specific heat capacity of liquids, our systems transfer large amounts of heat through liquid flow, capable of dissipating heat ranging from several hundred watts to over one kilowatt.

• Buried-tube Liquid Cold Plate: Fabricated by grooving plates, burying and welding copper tubes inside, then hermetically sealing via welding. Ensures reliable liquid tightness, operational safety, and high flatness for excellent thermal contact.
• Inserted-tube Liquid Cold Plate: Manufactured by embedding copper tubes onto aluminum plate surfaces using welding or bonding processes, with strict flatness control for minimal thermal resistance.
• Channel-type Liquid Cold Plate: Internal flow channels formed on copper or aluminum substrates through drilling, extrusion, and precision machining, sealed via friction welding or high-temperature brazing.
• Liquid Cooling Block: For high-power chip heat dissipation with internal flow channels created through skiving fin technology to maximize heat exchange surface area.

• Lasers and medical equipment
• EV power battery pack cooling
• Power electronics and motor drive devices
• Microwave 5G transmission systems
• Renewable energy systems
• IGBT and Power Semi-Conductor Systems
• Data centers and industrial power applications
• Defense systems and avionics
• Fuel cells and traction systems

We maintain rigorous quality standards with comprehensive testing equipment including:

• 1 Coordinate Measuring Machine
• 1 projector instrument
• 2 water high pressure testing machines
• 4 thermal resistance testing machines
• 2 liquid leakage testing machines

• Prompt response to all inquiries
• Competitive pricing with guaranteed quality
• Efficient production scheduling
• Optimal transportation solutions
• Comprehensive technical support