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Brazed Liquid Cooling Cold Plate Heat Dissipation Thermal Management Solution

Categories Cold Plate
Surface Flatness: 0.1 mm
Dimensions: Customizable
Extra Process: CNC Machining
Place of Origin: Dongguan,Guangdong,China
Heat Source Power: 24kW
Certification: SMC
Corrosionresistance: Yes, with proper coating
Brand Name: Uchi
Surface Treatment: Stamping + surface finish
Maxoperatingpressure: 10 bar
Payment Terms: T/T,paypal, Western Union,MoneyGram
MOQ: 100pcs
Bonding Technology: FSW, pressure pipe
Technology: Pipes bending
Delivery Time: not limited
Supply Ability: 50000000pcs per Month
Model Number: Heat Sink
Packaging Box Size: 42.5*33*18CM
Price: 1300-1500 dollars
Single Package Size: 45X40X10 cm
Ip Rating: IP65
Number Of Waterways: 6 waterways
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Brazed Liquid Cooling Cold Plate Heat Dissipation Thermal Management Solution

Brazed Liquid Cooling Cold Plate Heat Dissipation Thermal Management Solution
Brazed Liquid Cooling Plate

A brazed liquid cooling plate is a liquid-cooled heat dissipation plate formed by welding the upper and lower cover plates and the internal flow channels/fins in a high-temperature vacuum furnace using the brazing process. It features excellent sealing performance, precise flow channels, low thermal resistance and high pressure resistance, making it one of the mainstream processes for high-end liquid cooling plates.

Basic Structure

It generally consists of three layers:

  • Upper cover plate: provides sealing, interfaces and mounting surface
  • Middle layer: flow channel plate / turbulence fins / pin fins
  • Lower cover plate: bonding surface for heat-generating components

The three layers are metallurgically bonded into an integral unit through brazing.

Core Process: Vacuum Brazing
  1. Sheet metal forming → coating / pre-placing brazing filler metal
  2. Stacking and positioning → loading into vacuum brazing furnace
  3. High-temperature heating (approx. 600℃ for aluminum)
  4. Brazing filler metal melts, wets and fills gaps
  5. Cooling and forming to create high-strength sealed welds
Advantages:
  • No porosity, no cold joints, extremely high airtightness
  • High weld strength and good corrosion resistance
  • Enables complex and precise flow channel designs
  • Smooth surface, ideal for bonding high-power devices
Key Features
High Heat Dissipation Efficiency

Micro-channels, louvered fins and porous fins can be integrated in the middle layer, delivering large heat exchange area and low thermal resistance.

Strong Pressure Resistance

Standard pressure rating: 3~10 bar; high-pressure versions exceed 15 bar, suitable for fast charging, energy storage and electric motors.

Reliable Sealing

Fully welded structure with nearly zero leakage risk, compliant with helium leak testing.

Excellent Surface Flatness

Suitable for surface-mounted heat dissipation of IGBTs, SiC modules, power devices, battery packs and other planar components.

Material Composition

Mainly made of aluminum alloy using 3003, 5052, 6061 and other alloys, offering lightweight design, high thermal conductivity and moderate cost.

Common Flow Channel Designs
  • Serpentine flow channel: simple structure, low pressure drop
  • Staggered / parallel multi-channels: uniform heat transfer
  • Micro-channel fins: for high heat flux density scenarios
  • Pin fin array: ultra-high heat transfer, suitable for GPUs / lasers
Typical Applications
  • New energy vehicles: motor controllers, OBC, DC-DC converters, 800V SiC modules
  • Energy storage & fast charging: PCS energy storage converters, ultra-fast charging stations, heat dissipation for flash charging shunts
  • Industrial control & power: SVG, photovoltaic inverters, high-voltage inverters
  • Optoelectronics & computing power: lasers, GPU servers, radar systems
Comparison with Other Liquid Cooling Plates
Comparison TypeAdvantages
vs Friction Stir Welded Liquid Cooling PlatesBrazing is more suitable for precise flow channels and high heat flux density; friction welding performs better for large-size and high-flow applications.
vs Extruded Profile Liquid Cooling PlatesBrazed plates offer more flexible flow channel design and stronger heat dissipation, at a higher cost.
vs Tube-embedded Liquid Cooling PlatesBetter bonding performance and lower thermal resistance, ideal for high-power devices.
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