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12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

Categories Server PCB
Model Number: XSWPCB
Material: FR4
MOQ: 1
Delivery Time: 8-15DAYS
Surface Finish: Green
Payment Terms: Western Union
Place of Origin: China
Copper Thickness: 1/1/1/1/1/1/1/1/1/1/1/1 oz
Supply Ability: 1 Million Square feet/per month
Certification: UL ,IOS9000
Board Thickness: 1.6 mm (Customizable)
Price: Negotiable
Brand Name: XSW PCB
Layer Count: 12-Layer
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12 Layers Server Communication PCB For Fast Secure Data Processing And Storage

12 Layers Server Communication PCB For Fast Secure Data Processing And Storage


The 12 Layers Server Communication PCB is engineered for high-speed data processing, secure communication, and large-scale data storage applications. Designed with a complex multilayer stack-up, this PCB provides exceptional signal integrity, power distribution efficiency, and electromagnetic interference (EMI) suppression required by modern servers, data centers, cloud computing platforms, and communication equipment.

Manufactured using high-quality low-loss materials and advanced PCB fabrication technology, the board supports high-frequency signal transmission, high-density component integration, and reliable long-term operation. Its 12-layer architecture enables optimized routing for high-speed interfaces, ensuring stable performance in mission-critical networking, storage, and enterprise computing environments.


Key Specifications
Layer Count12-Layer
MaterialFR4
Board Thickness1.6 mm (Customizable)
Copper Thickness1/1/1/1/1/1/1/1/1/1/1/1 oz
Minimum Hole Size0.25 mm
Minimum Line Width0.1 mm
Minimum Line Spacing0.1 mm
Solder Mask ColorGreen
Surface FinishENIG

Product Description

  • 12-Layer High-Density Design
    • Provides ample routing space for complex server and communication circuits.
    • Supports high-density component placement and advanced processor architectures.
  • High-Speed Signal Integrity
    • Optimized stack-up structure minimizes signal loss, crosstalk, and transmission delays.
    • Suitable for high-speed networking and data communication protocols.
  • Fast Data Processing Capability
    • Designed to support multi-core processors, memory modules, and high-bandwidth interfaces.
    • Enables efficient data transfer within server and storage systems.
  • Enhanced Data Security and Reliability
    • Stable power distribution and signal routing help ensure secure and uninterrupted system operation.
    • Reduces communication errors in critical applications.
  • Excellent EMI and EMC Performance
    • Multiple ground and power planes improve electromagnetic compatibility.
    • Minimizes interference in high-frequency environments.
  • Design Specifications
ItemMass Production CapabilityExtreme Capability
Board Thickness Range0.3~6.0mm0.3~6.0mm
Exposure Alignment Accuracy±0.015mm±0.005mm
Minimum Annular RingSingle side ≥0.05mmSingle side ≥0.05mm
Min Line Width/Space (1/3oz base copper)0.05mm / 0.05mm0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)0.05mm / 0.05mm0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)0.075mm / 0.075mm0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)±0.005mm±0.005mm
Etching Tolerance (1/2oz base copper)±0.005mm±0.005mm
Etching Tolerance (1oz base copper)±0.0075mm±0.0075mm
Gold Finger Total Pitch Tolerance<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
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