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Network Server PCB 6 Layer 1.6mm Thickness Multilayer PCB Board

Categories Server PCB
Model Number: XSWPCB
Material: FR4
MOQ: 1
Delivery Time: 8-15DAYS
Surface Finish: Green
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Certification: UL ,IOS9000
Board Thickness: 1.6 mm (Customizable)
Place of Origin: China
Copper Thickness: 1/1/1/1/1/1 oz
Price: Negotiable
Brand Name: XSW PCB
Layer Count: 6-Layer
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Network Server PCB 6 Layer 1.6mm Thickness Multilayer PCB Board

1.6 mm Board Thickness 6 Layer Multilayer Pcb Network Server PCB

The 1.6 mm Board Thickness 6 Layer Multilayer PCB is designed for network servers, data communication equipment, storage systems, and high-speed computing applications. Built with a six-layer stack-up structure, this PCB provides excellent signal integrity, stable power distribution, and enhanced EMI suppression for demanding networking environments. Manufactured using high-quality FR-4 materials and advanced PCB fabrication processes, it supports high-density component layouts and reliable long-term operation in enterprise-grade server systems.

Key Specifications
Layer Count6-Layer
MaterialFR4
Board Thickness1.6 mm (Customizable)
Copper Thickness1/1/1/1/1/1 oz
Minimum Hole Size0.25 mm
Minimum Line Width0.1 mm
Minimum Line Spacing0.1 mm
Solder Mask ColorGreen
Surface FinishENIG

Product Description

  • 6-Layer Multilayer Design
    • Optimized routing for high-speed signals and complex network architectures.
    • Supports dense component placement and advanced server motherboard layouts.
  • Standard 1.6 mm Board Thickness
    • Provides excellent mechanical strength and dimensional stability.
    • Compatible with industry-standard server and networking equipment.
  • Superior Signal Integrity
    • Controlled impedance design for high-frequency data transmission.
    • Reduces signal loss, crosstalk, and transmission errors.
  • Reliable Power Distribution
    • Dedicated power and ground planes improve voltage stability.
    • Supports high-performance processors, memory modules, and communication chips.
  • Enhanced EMI/EMC Performance
    • Multilayer stack-up structure minimizes electromagnetic interference.
    • Suitable for high-speed Ethernet, cloud computing, and data center applications.
  • High Manufacturing Precision
    • Supports fine line widths, small vias, and high-density interconnect layouts.
    • Ideal for advanced networking and server hardware designs.
  • Design Specifications
ItemMass Production CapabilityExtreme Capability
Board Thickness Range0.3~6.0mm0.3~6.0mm
Exposure Alignment Accuracy±0.015mm±0.005mm
Minimum Annular RingSingle side ≥0.05mmSingle side ≥0.05mm
Min Line Width/Space (1/3oz base copper)0.05mm / 0.05mm0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)0.05mm / 0.05mm0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)0.075mm / 0.075mm0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)±0.005mm±0.005mm
Etching Tolerance (1/2oz base copper)±0.005mm±0.005mm
Etching Tolerance (1oz base copper)±0.0075mm±0.0075mm
Gold Finger Total Pitch Tolerance<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
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