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| Categories | Multilayer Printed Circuit Board |
|---|---|
| Model Number: | XSWPCB |
| Certification: | UL ,IOS9000 |
| Material: | FR4 TG150 |
| Place of Origin: | China |
| Delivery Time: | 8-15DAYS |
| Minimum Hole Size: | 0.2 mm three sides |
| Minimum Line Spacing: | 0.12 mm |
| MOQ: | 1 |
| Payment Terms: | Western Union |
| Board Thickness: | 1.6mm |
| Copper Thickness: | 1/1/1/1/1/1 oz |
| Minimum Line Width: | 0.12 mm |
| Price: | Negotiable |
| Brand Name: | XSW PCB |
| Layer Count: | 6 |
| Supply Ability: | 1 Million Square feet/per month |
| Company Info. |
| Shenzhen Xunsiwei Circuit Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
| Layer Count | 6 |
| Material | FR4 TG150 |
| Board Thickness | 1.6mm |
| Copper Thickness | 1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2 mm three sides |
| Minimum Line Width | 0.12 mm |
| Minimum Line Spacing | 0.12 mm |
| Solder Mask Color | Green |
| Surface Finish | ENIG |
| Application Field | Embedded Control Product |
Product Description:
Lamination & Material Selection
| Focus Area | Specific Requirements |
|---|---|
| Substrate | High-Tg FR-4 (Tg ≥ 150°C, 170°C recommended), low moisture absorption, good heat resistance |
| Copper Foil Thickness | Signal layer: 0.5oz ~ 1oz; Power/GND layer: 1oz ~ 2oz; High-current paths: ≥ 2oz |
| Lamination Symmetry | Multilayer stack-up must be symmetrical to prevent board warpage |
Design for Manufacturing (DFM)
| Focus Area | Recommended Design Value | Typical Minimum Capability |
|---|---|---|
| Trace Width/Spacing | ≥ 6mil | 4mil |
| Via Hole Diameter | 0.3mm (signal), 0.4~0.5mm (power) | 0.2mm (laser), 0.3mm (mechanical) |
| Pad Size | 0.1~0.2mm wider than pin | — |
| Silkscreen | Line width ≥ 5mil, keep clear of pads and vias | — |
| Test Points | Reserve on critical signals and power nets; spacing ≥ 1.27mm |
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm | <30mm: ±0.03mm 30~60mm: ±0.05mm |
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