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| Categories | Multilayer Printed Circuit Board |
|---|---|
| Model Number: | XSWPCB |
| Material: | FR4 |
| MOQ: | 1 |
| Delivery Time: | 8-15DAYS |
| Minimum Hole Size: | 0.2mm |
| Payment Terms: | Western Union |
| Solder Mask Color: | Black |
| Place of Origin: | China |
| Copper Thickness: | 1/1/1/1/1/1/1/1 oz |
| Supply Ability: | 1 Million Square feet/per month |
| Certification: | UL ,IOS9000 |
| Board Thickness: | 1.0mm |
| Price: | Negotiable |
| Minimum Line Width: | 0.1mm |
| Brand Name: | XSW PCB |
| Layer Count: | 8 Layers |
| Company Info. |
| Shenzhen Xunsiwei Circuit Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
| Layer Count | 8 Layers |
| Material | FR4 |
| Board Thickness | 1.0 mm |
| Copper Thickness | 1/1/1/1/1/1/1/1 oz |
| Minimum Hole Size | 0.2mm |
| Minimum Line Width | 0.1mm |
| Minimum Line Spacing | 0.1mm |
| Solder Mask Color | Black |
| Surface Finish | OSP |
| Application Field | Industrial Control and Automation Systems |
Our multilayer high-density PCBA printed circuit board assemblies
are specially engineered for tablet devices. Adopting advanced HDI
high-density wiring technology, these multilayer circuit boards
achieve compact line width/spacing and dense component layout,
which perfectly satisfy the thin, lightweight and miniaturization
design demands of tablets.
We provide turnkey PCBA services including multilayer PCB
fabrication, component sourcing, SMT mounting, BGA soldering,
functional testing and final assembly. The boards support stable
transmission of display signals, power management, touch control
and wireless communication circuits inside tablets. Manufactured in
accordance with IPC, UL and RoHS standards, they deliver reliable
performance for consumer tablet PCs, educational tablets and
industrial rugged tablets. Custom Gerber-based development,
prototype sampling and mass production are all supported.
1.Multilayer HDI high-density wiring design, realize
miniaturization layout for slim tablet structure
2.Support fine line width & spacing, micro vias, suitable for dense
chip placement such as CPU, PMIC
3.Turnkey one-stop service: PCB manufacturing + components
procurement + SMT & BGA assembly + testing
4.Optimized impedance control for LCD display, touch screen,
Wi-Fi/Bluetooth signal transmission
5.Multiple surface finishes optional: ENIG, immersion gold, OSP to
meet tablet long-term stability requirements
6.Strict quality control: AOI, X-Ray inspection, ICT and functional
testing before delivery
7.High TG substrate options, excellent thermal stability to adapt
tablet continuous operation
8.Meet RoHS lead-free requirements, UL certification available upon
customer request
9.Thin board thickness options, matching ultra-thin tablet shell
assembly space limitation
10.Widely applicable for consumer tablets, kids learning tablets,
industrial rugged tablet motherboards
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm | <30mm: ±0.03mm 30~60mm: ±0.05mm |
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