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ESD-Safe Reusable IC Chip Tray with Precision Cavity for Secure Semiconductor Storage

Categories IC Chip Tray
Model Number: HN24187
MOQ: 500 pcs
Capacity: 10x10=100 PCS
Brand Name: Hiner-pack
Delivery Time: 10 workdays
Packaging Details: CARTON, PALLET
Payment Terms: T/T
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Warpage: Warpage MAX 0.21mm
Quality Assurance: Delivery Guarantee, Reliable Quality
Outline Line Size: 50.8×50.8×4 mm
Incoterms: EXW, FOB, CIF, DDU, DDP
Reusable: Yes
Packing Level: Transport package
Tray Shape: Rectangular
Mold Type: Injection
Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Clean Class: General And Ultrasonic Cleaning
Supply Ability: 2000PCS/Day
Ic Type: BGA,QFP,QFN,LGA,PGA
Cavity Size: 1.57x0.98x0.41 mm
Place of Origin: China
Color: Black
Certification: ROHS, ISO
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  • Product Details
  • Company Profile

ESD-Safe Reusable IC Chip Tray with Precision Cavity for Secure Semiconductor Storage

Secure ESD-Safe IC Chip Trays for Semiconductor Storage

Deliver precision cavity structure to hold delicate IC chips firmly, preventing shifting and electrostatic damage during handling. Built with durable material for consistent performance in industrial environments. Provide reliable ESD protection for sensitive semiconductor components. Seeking secure trays for safe chip storage?


Integrate seamlessly with automated packaging lines and cleanroom workflows. Perform steadily in chip loading, transfer, and inventory management procedures. Adapt smoothly to diverse semiconductor manufacturing scenarios.


Support fully customized cavity size and layout to match specific chip dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect IC chips throughout transit.

Key Features/ Benefits
  • Durable construction
  • Precision cavity layout
  • Durable construction
  • Protects delicate fine pitch IC components efficiently
  • ESD-safe design
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
BrandHiner-pack
ModelHN24187
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size50.8×50.8×4 mm
Cavity Size1.57x0.98x0.41 mm
Matrix QTY10x10=100 PCS
WarpageMAX 0.21mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Support semiconductor die attach, device testing, cleanroom assembly, and precision component kitting operations. Pair seamlessly with pick-and-place machines, Class 100 cleanroom environments, and ESD-controlled production lines.


Also used for finished IC inventory storage, inter-plant component transport, and international shipping of electrostatic-sensitive devices. Serve semiconductor fabs, OSATs, and global electronic component distributors.

Customized Services
Provide fully tailored solutions for ESD-safe IC waffle trays. Modify cavity dimensions, spacing, and layout to fit diverse die sizes and packaging needs.

Utilize high-performance ESD-safe material for enhanced durability. Offer prototype validation and personalized design support to optimize production and shipping workflows.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
Buy ESD-Safe Reusable IC Chip Tray with Precision Cavity for Secure Semiconductor Storage at wholesale prices
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