precision ic package substrate

Brand Name:Horexs

Model Number:NC-02

Place of Origin:china

Precision 0.15mm IC Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

...Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200...

Brand Name:Suneast

Model Number:WBD2200 PLUS

Place of Origin:Shenzhen, Guangdong Province, China

...Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die bonding technology Bottom photo-taking, high precision...

Brand Name:Seacent

Model Number:Fiber Array-24Channel

Place of Origin:Guangdong,China

24 CH fiber array with high precision V-groove substrate Description: Seacent's fiber arrays are fabricated with high precision V-groove substrate by Browave unique assembly/polish process to get an excellent accuracy of fiber core position and perfect...

Brand Name:TI

Model Number:OPA2388QDGKRQ1

Place of Origin:original

OPA2388QDGKRQ1 Amplifier IC Chips Dual Automotive Qualified Wide-Bandwidth Precision Amplifier Package VSSOP-8 GBP - Gain Bandwidth Product: 10 MHz SR - Slew Rate: 5 V/us CMRR - Common Mode Rejection Ratio: ...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Brand Name:Hiner-pack

Model Number:JEDEC TRAY SERIES

Place of Origin:China

... Matrix Tray Stackable For IC Packaging Industry Offering both standard and custom configurations, our JEDEC trays meet a wide range of semiconductor packaging needs. This JEDEC matrix tray is crafted for precision and efficiency in electronics component ...

Brand Name:Guofeng

Model Number:25um

Place of Origin:China

Polyimide-film-based, precision-laminated copper substrate for flexible circuits Product Overview: The GL series is a leap forward in polyimide film performance. Its proprietary manufacturing process creates a uniquely oriented molecular structure, ...

Brand Name:SHENHUA

Model Number:SC810

Place of Origin:Guangdong, China

...IC packaging parts auto cleaning system with trial chemical wash sections. SC830 is a high wash ability FC packaging deflux cleaning system. 810 IC packaging auto cleaing machine is used to clean flux residuals, soder balls and particles on FC package products, such as: rosin flux, water-soluble flux , non-clean flux ,solder paste and other organic and inorganic contaminations. Precise...

Model Number:AD517JH

Place of Origin:Malaysia

AD517JH Low Cost, Laser Trimmed, Precision IC Op Amp FEATURES Low Input Bias Current: 1nA max Low Input Offset Current: 0.25nA max ...

Brand Name:Lingyao

Model Number:LYVTJ-II

Place of Origin:China(Thailand available)

Pharma Automatic Cartoning Machine for Precision Pill Packaging, 180 Boxes per Hour, GMP Compliant Design Revolutionize Your Pharma Packaging with the Next-Gen Automatic Cartoning Machine Ideal for blister packs, vials, and syringe kits, our Pharma ...

Brand Name:MOLEX

Model Number:1054110104

Place of Origin:USA

..., an output load of 10pF, and a storage temperature range of -55°C to +125°C. This crystal oscillator IC is an ideal choice for applications that require precise timing and frequency control. It provides superior frequency stability and accuracy and is

Brand Name:JIMA

Model Number:Customizable

Place of Origin:China

... a 99mm diameter and dimensions of D99*H31mm, features a 401# caliber and a 170ml capacity. Tailored for small - capacity packaging needs, it combines the advantages of a two - piece structure and customization to provide a precise packaging solution for

Brand Name:kenwei

Model Number:JW-B4

Place of Origin:China

High Precision Automated Packaging Machine For Snacks Food The automatic vertical filling sealed packaging production line with multi-head scales is suitable for weighing granules, slices, rolls, or irregular shaped products, such as candy, seeds, ...

Brand Name:ASLI

Model Number:RHD-45

Place of Origin:China

... Drying Oven for IC Packaging with PID Control Product Description High Temperature Drying Oven can provide a stable test space for pre-heating, drying, changes about physics and chemistry testing. It supplys precision temperature controllter wit...

Place of Origin:R.P. of China

Brand Name:SOPERSL

Model Number:DC82403LE

IC PCB storage dry cabinet / digital dry cabinet high performance Applications: DC82403LE is equipped with a precise LED control, which has ±3%RH precision tolerance. It is especially designed with fully automatic humidity control at <10%RH to prevent...

Brand Name:WINNER

Model Number:YF-9

Place of Origin:CHINA

...game - changer in the field of high - reliability IC packaging. Made of high - purity silver, this bonding wire offers excellent electrical conductivity, ensuring efficient signal transmission in ICs. The composite material treatment further enhances its