nova plus flip chip die bonder

Brand Name:ASM

Model Number:NOVA Plus

Place of Origin:China

...NOVA Plus Flip Chip Die Bonder Machine Original And Used ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder...

Brand Name:GKG

Model Number:GD602D

Place of Origin:China

... for 180° cross-bonding. 2. Compatible with a printer to enable a variety of in-line process solutions. 3. Fully integrated carrier from loading, printing, to die bonding and

Brand Name:Suneast

Model Number:WBD2200 PLUS

Place of Origin:Shenzhen, Guangdong Province, China

...PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die...

Brand Name:Unicomp

Model Number:AX9100vs

Place of Origin:China

Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features...