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All ltv ttv bow warp sic wafer wholesalers & ltv ttv bow warp sic wafer manufacturers come from members. We doesn't provide ltv ttv bow warp sic wafer products or service, please contact them directly and verify their companies info carefully.
| Total 5 products from ltv ttv bow warp sic wafer Manufactures & Suppliers |
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Brand Name:PAM-XIAMEN Place of Origin:China .... SiC wafer is a next generation semiconductor materialwith unique electrical properties and excellent thermal properties for high temperature and high power device application. SiC wafer can be supplied in diameter 2~6 inch, both 4H and 6H SiC , N-type , |
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
Fujian |
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Brand Name:ZMSH Model Number:Silicon Carbide Place of Origin:China Product Description: ZMSH — Innovative Manufacturer and Supplier of SiC Substrate Wafers As the leading manufacturer and supplier of SiC (Silicon Carbide) substrate wafer, ZMSH not only offers the best price on the market for 2 inch and 3 inch Research ... |
SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai |
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Brand Name:BonTek Model Number:SAP Place of Origin:China ...TTV ≤3μm for Precision Applications Product Description: Sapphire Slice/Plate/Wafer is a precision product made of sapphire crystal. It features high parallelism (≤3 Arc Sec), diameter (2inch-8inch), orientation (±30'), bow & warp (≤20μm) and thickness (0.5mm-3mm). It is widely used in electronic, optoelectronic, aerospace, and other high-tech industries. Sapphire wafer... |
Hangzhou Freqcontrol Electronic Technology Ltd.
Shanghai |
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Brand Name:zmkj Model Number:6inch Place of Origin:china ... degree Primary flat orientation: A plane +/- 1 degree Primary flat length: 47.5 mm +/- 1 mm Total Thickness Variation (TTV): <20 um Bow: <25 um Warp: |
SHANGHAI FAMOUS TRADE CO.,LTD
Shanghai |
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Brand Name:Silian Model Number:100mm /4 inch Place of Origin:China ...Wafer Single Side Polished Specification Orientation (22-43)Plane offcut 0.45° away from C plane-per sketch 22-43 Diameter 100mm ± 0.2mm Thickness 650um ± 20um / 850um ± 20um Bow <10 microns Warp <20 microns TTV <10 microns Major Flat M-axis +0.3°; 32+1mm Minor Flat None Front Side < 0.30nm Back Side <1.2 micron Laser ID marked on backside by major flat Packaged Cassette containing 25 wafers... |
Chongqing Silian Optoelectronic Science & Technology Co., Ltd.
Chongqing |