inp semiconductor substrate

Brand Name:zmkj

Model Number:InP

Place of Origin:CHINA

2inch InP wafers 3inch 4inch N/P TYPE InP Semiconductor Substrate Wafers Doped S+/ Zn+ /Fe + growth (modified VFG method) is used to pull a single crystal through a boric oxide liquid ...

Brand Name:ZMSH

Model Number:Indium Phosphide Wafer

Place of Origin:China

Indium Phosphide Wafer InP Semiconductor Substrates Epitaxial 2'' 3'' Thickness 350um Description of Indium Phosphide: Indium Phosphide (InP) chips are a widely used material in optoelectronics and semiconductor devices. It has the following advantages: ...

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...

Brand Name:PAM-XIAMEN

Place of Origin:China

...InP(Indium Phosphide) Substrate,3”, Prime Grade -Compound Semiconductor PAM-XIAMEN offers InP wafer – Indium Phosphide which are grown by LEC(Liquid Encapsulated Czochralski) or VGF(Vertical Gradient Freeze) as epi-ready or mechanical grade with n type, p type or semi-insulating in different orientation(111)or(100). Indium phosphide (InP) is a binary semiconductor...

Brand Name:ZG

Model Number:MS

Place of Origin:CHINA

InP Based Epi Wafer We provides MBE / MOCVD epitaxial growth of custom structure on InP substrate for microelectronics , optoelectronics and RF Microwave applications , in diameter Ø 2" to Ø 4” . With our extensive MOCVD experience , we can grow binary alloy ( InP ) or ternary alloy ( InGaAs , InAlAs , InGaAsP ) on InP substrate...

Brand Name:ON Semiconductor

Model Number:NC7WZ14P6X

ON Semiconductor IC NC7WZ14P6X IC INVERT SCHMITT 2CH 2-INP SC88 Manufacturer: onsemi Product Category: Inverters RoHS: Details Number of Circuits: 2 Circuit Logic Family: NC7WZ Logic Type: ...

Brand Name:wuxi special ceramic

Place of Origin:China

... thermal conductivity Aluminum Nitride (AIN) ceramic, this substrate offers exceptional thermal management and electrical insulation properties, making it an ideal choice for a wide range of industrial applications. Surface Finish: ...

Place of Origin:China

Brand Name:TOP SENSOR

Semiconductor Strain Gauge Transducer SPD High Speed Bending Plate Scales Semiconductor Strain Gauges SPD Semiconductor strain gauge (in the substrate) Send Inquiry SPECIFICATION Related Products Semiconductor strain gauge (in the substrate) F1 F2 F3 F4 F5 substrate: 8×4 silicon: D leg: 30 substrate: 7×4 silicon: B,C leg: 20~25 substrate: 8×3.5 silicon: B,C,D leg: 22 substrate: 8×2.5 silicon: B,C leg: 7.5~7.8 substrate...

Brand Name: Yuxing

Place of Origin:china

Product Description: Our Ceramic Substrates are engineered to meet the demanding requirements of modern industrial applications, offering exceptional performance and reliability. These Industrial Ceramic Substrates are designed with a focus on durability, ...

Brand Name:Xingqiang

Model Number:As Per Customer's Model

... substrates support critical signal routing, thermal dissipation, and mechanical stability for advanced semiconductor applications. Our team tailors layer structures, line widths, pad layouts, and array formats to match your specific chip requirements,

Brand Name:Jinghui Ceramics

Model Number:Customized

Place of Origin:China

... ceramic substrate; 2. The thermal expansion coefficient (3.1×10-6/℃) matches the semiconductor silicon material (3.5-4.0×10-6/℃); 3. The bending strength is higher than that of the alumina substrate, which is twice that of the alumina substrate; 4.

Brand Name:JINXING

Model Number:Molybdenum Wafer

Place of Origin:China

... lamp durable, it must be equipped with reliable and robust components. With our molybdenum, MoCu and WCu wafer substrates, LED chips can easily reach 100,000 hours of service life. ​ Description Wafer substrate made of molybdenum, molybdenum copper and

Brand Name:Hongshun

Model Number:HS-6684MF

Place of Origin:Guangdong

... for the ultra-high-purity demands of semiconductor and LCD substrates, delivering residue-free, damage-free cleaning critical for electronic component performance. It combines two powerful technologies: high-frequency ...

Brand Name:PRM

Model Number:custom

Place of Origin:China

...a metal material that uses a molybdenum-copper substrate as a base material and covers a uniform nickel layer on the surface of the molybdenum-copper substrate by electroplating a nickel layer. This substrate has high strength, high thermal conductivity,

Brand Name:TJIN

Place of Origin:China

...substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm; ● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm). Product Description: Semiconductor Molding Machine - Product Overview The Semiconductor ...

Brand Name:BonTek

Model Number:Sapphire (Al2O3)

Place of Origin:China

... Substrate For Semiconductor Sapphire wafers are mainly suitable for the research and development of new semiconductor devices, offering high specifications such as high smoothness and high cleanliness in addition to the traditional sapphire substrate ...

Brand Name:HY

Model Number:HY-TCJP

Place of Origin:China Yixing

...semiconductor-integrated circuit led lamp Alumina ceramic basic chip product name:Alumina ceramic basic chip product description: As a substrate material, alumina ceramic substrate is widely used in RF and microwave electronics industry. Its high dielectric constant can make the circuit miniaturized. Its thermal stability is good, the temperature drift is small, the substrate...

Brand Name:PRM

Model Number:custom

Place of Origin:China

...a metal material that uses a molybdenum-copper substrate as a base material and covers a uniform nickel layer on the surface of the molybdenum-copper substrate by electroplating a nickel layer. This substrate has high strength, high thermal conductivity,

Brand Name:CAEC

Place of Origin:Henan, China

... as carrier tape and protective substrate during the dicing and grinding process. UV tape is mainly composed of release film, acrylic adhesive and base film. Main application Semiconductor: Dicing of various types of package(BGA/QFN/DFN), wafer sawing and