enepig bga substrate

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm...

Brand Name:Huashengxin

Model Number:135013

Place of Origin:China

Small BGA Double Sided PCB Board Prototype ENEPIG PCB Green Solder Mask 7mil Double Sided PCB Double Sided ENEPIG PCB Small BGA And Impedance Control Green Solder Mask Double Sided ENEPIG PCB HSX Circuit covers a total production area of 10,000 square ...

Brand Name:Rogers

Model Number:RO4730G3

Place of Origin:China

...Substrate with ENEPIG Finish The RO4730G3 PCB is a high-performance, custom-designed circuit board tailored for advanced RF and microwave applications. Built on Rogers RO4730G3 hydrocarbon/ceramic laminate, this PCB offers a powerful combination of low dielectric loss, exceptional thermal stability, and ease of manufacturability. The 20mil substrate, combined with 1oz (35μm) copper weight and ENEPIG...

Brand Name:Bicheng

Model Number:BIC-332.V1.0

Place of Origin:CHINA

...integrates PTFE and ceramic substrate advantages while overcoming their mechanical and manufacturing limitations. Compliant with industrial standards, it features 0.5mm finished thickness, 1 oz outer-layer copper weight, and ENEPIG surface finish, ensuring...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

... of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of

Brand Name:XCE

Model Number:XCEM

Place of Origin:China

... of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example) Yellow and white core plate divided core material, usually ...

Brand Name:CESGATE

Model Number:NA

Place of Origin:China

... BGA X Ray Inspection The printed circuit board is abbreviated as PCB, also known as printed circuit board, printed circuit board, etc. It is a circuit board that forms point-to-point connections and printed components on a common substrate according...

Brand Name:BOTO

Model Number:BT

Place of Origin:CHINA

... components, metal, chemical materials, automation components, communication module, national defense industry, aerospace industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic and high polymer materials. Characteristics: 1. Short

Brand Name:HNL-PCBA

Model Number:PCB Assembly 04

Place of Origin:CHINA

...BGA DIP Rigid PCB Assembly PCB SMT Assembly Introduction Haina Lean Technology CO., LTD is our factory. We build amazing electronics. From prototype to production, we are entrusted to be their electronic manufacturing partner by companies small and large around the world. PCBA CAPABILITIES Layers 1 - 46 L Substrate...

Brand Name:IBE

Model Number:FG-01

Place of Origin:CHINA,VIETNAM,USA

... circuit boards. The traces or conductive pathways engraved in the laminated copper sheets of PCBs are used within a non-conductive substrate in order to form the assembly.SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB

Brand Name:WITGAIN PCB

Model Number:PCB0039

Place of Origin:China

... thickness is 35 um on each layer 4 FR4 substrate material , TG170 degree. 5 Surface treatment is OSP. 6 BGA pad size 8.8mil. 7 Finished board thickness is 1.2mm. 8 Gerber file or PCB file should be offered by customer before production. 9 Differential ...

Place of Origin:Shenzhen ,China

Brand Name:OEM,ODM

Model Number:zt-pcb-0151

... high quality Multilayer Substrate FR4 PCB Supplier with SMT Assembly Services 1.Fast PCB Fabrication for Samples and Mass Production 2.Electronic Components Sourcing Servics 3.PCBA Assembly Services:SMT,DIP,BGA... 4.Function Test 5.Stencil and Enclosure...

Brand Name:SenYan

Model Number:FR4 PCB

Place of Origin:China

...-1 ) FPC,PCB Copy Service. PCB Assembly Service. (SMT, BGA, DIP) IC program with HEX file. PCBA Housing assembly serivce. PCBA Final Functional Testing. PCBA Copy ...

Place of Origin:China

Brand Name:CUSTOM MADE

...Substrate PCB Layout Design Producibility Multi-Layer Boards Rogers PCB Layout Design Description: 1. High-Speed PCB Design 2. 40G / 100G System Design 3. Mixed Digital PCB Design 4. SI/PI EMC Simulation Design PCB Layout Design Parameters: SMT Capability 14 million spots per day SMT Lines 12 SMT lines Reject Rate R&C: 0.3% IC: 0% PCB Board POP boards/Normal Boards/FPC boards/Rigid-flex boards/Metal base boards Parts Dimension Min BGA

Brand Name:JUKI

Model Number:KE2060L

Place of Origin:JAPAN

...range: 0402(1005)-SOP.PLCC.QFP.BGA, 1, substrate size M substrate (330 × 250mm) For the L substrate (410 x 360mm). Lwide (510 x 360mm). For E substrate (510×460mm) 2, component size 0603 chip (inch 0201) chip ~ 20mm square element or 26.5 × 11mm (0402 (...

Place of Origin:China

Brand Name:OEM

... type JUKI Element for mounting 0402, 0603, 0805, 1206 0603, 0805, 3014, 5050 SOT, SOP, QFN, BGA, etc Substrate minimum size 10×10 mm Substrate maximum size 320×450 mm Substrate thickness ≤2mm Belt-type feeder: 8, 12, 16, 24 mm

Brand Name:LIYI

Model Number:LY-TS

Place of Origin:CHINA

... materials, automation components, communication module, national defense industry, aerospace industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic and high polymer materials. Characteristics 1. Short temperature recovery time The maximum

Brand Name:xingqiang

Model Number:As Per Customer's Model

Place of Origin:China

.... Its black substrate and golden pads ensure excellent solderability and corrosion resistance, ideal for mounting precision components like BGAs. Widely used in industrial control devices, medical equipment, or communication hardware, it integrates complex

Brand Name:CAEC

Place of Origin:Henan, China

... as carrier tape and protective substrate during the dicing and grinding process. UV tape is mainly composed of release film, acrylic adhesive and base film. Main application Semiconductor: Dicing of various types of package(BGA/QFN/DFN), wafer sawing and

Brand Name:Kejian Kinsgeo

Model Number:KJ-2092

Place of Origin:Dongguan China

... machine of electronic components, metal, chemical materials, automation components, communication module, national defense industry, aerospace industry, BGA, PCB substrate,