enepig bga package substrate

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/...

Brand Name:Jiaqing Circuit

Place of Origin:China

...substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:Original Factory

Model Number:APL1096/343S00474

Place of Origin:CN

...BGA Package IC Chip​ Product Description Of APL1096/343S00474 APL1096/343S00474 is IC Chip​ - Power Management Circuit​, BGA Package. Specification Of APL1096/343S00474 Part Number: APL1096/343S00474 Package: BGA Category: Iphone IC Chip Mounting Type: Surface Mount Product Photo Of APL1096/343S00474 Other Electronic Components In Stock Part Number Package PPC405EXR-NPD333T BGA...

Categories:BGA Assembly

Country/Region:china

...BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection ♦ What is BGA Assembly? BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA...

Brand Name:UNICOMP

Model Number:AX9500

Place of Origin:China

... PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (...

Brand Name:XILINX / AMD

Model Number:XC6SLX150-2FGG676I

Place of Origin:original

...BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package...

Brand Name:CESGATE

Model Number:NA

Place of Origin:China

BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build Technical Requirement for turnkey pcb ...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...

Brand Name:Ziitek

Model Number:TIF030-05

Place of Origin:China

3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich ...

Brand Name:Bicheng

Model Number:BIC-954.V1.0

Place of Origin:CHINA

SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It’s fabricated per IPC 7525A...

Brand Name:Hiner-pack

Model Number:HN23111

Place of Origin:SHENZHEN CN

Black JEDEC Tray That Holds The BGA-Packaged Chip Complies With Standard Design Product Description: JEDEC Trays: The Safest Way to Handle and Transport Semiconductor Devices When it comes to semiconductor devices such as integrated circuits (ICs), safe ...

Brand Name:Analog Devices

Model Number:LTM4622IY

Place of Origin:China

... Regulator with 95% Efficiency 3.1-20V Input andplusmn;1.5% Output Accuracy 2.5MHz Switching and 6.25mm andtimes; 6.25mm BGA Package andnbsp; FEATURES n Complete Solution in andlt;1cm2 n Wide Input Voltage Range: 3.6V to 20V n 3.3V Input Compatible with ...

Place of Origin:Malaysia

Brand Name:N/A

Model Number:MPC8260AZUPIBB

MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active Core Processor MSP430 Core Size 16-Bit ...

Brand Name:ELPIDA

Model Number:E1116AEBG-8E-F

Place of Origin:China

New Original E1116AEBG-8E-F BGA Packaged Flash Memory PRODUCT DESCRIPTION Part number E1116AEBG-8E-F is manufactured by ELPIDA and distributed by Stjk. As one of the leading distributors of electronic products, we carry many electronic components from the ...

Brand Name:Qualcomm

Model Number:CSR8645B04-IBBC-R

Place of Origin:USA

CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute ...

Model Number:ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B

Place of Origin:Malaysia

...BGA IC Integrated Circuits Components Specification :ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Category Integrated Circuits (ICs) Product Name Electronic components Model number ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package...

Categories:IC Substrate PCBs

Country/Region:china

Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, ...

Brand Name:ADI

Model Number:ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B

Place of Origin:Malaysia

...BGA IC Integrated Circuits Components Specification :ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Category Integrated Circuits (ICs) Product Name Electronic components Model number ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Mfr FAIRCHILD Series IC Components Package Standard package Condition New and original Package...

Categories:IC Substrate PCBs

Country/Region:china

Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, ...