dram memory packaging fr4 substrate

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

...Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.15mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4...

Brand Name:Original Factory

Model Number:MT62F1G64D8WT-031

Place of Origin:CN

Memory IC Chip MT62F1G64D8WT-031 LPDDR5 DRAM Memory IC 6.4Gbps FBGA Package​ Product Description Of MT62F1G64D8WT-031 MT62F1G64D8WT-031 - LPDDR5 DRAM Memory IC for Mobile Devices and Artificial Intelligence (AI) are designed to meet the demands of 5G networks. The DRAM...

Brand Name:FORESEE

Model Number:F60C1A0002-M69W

Place of Origin:CN

Dynamic Random Access Memory DRAM IndustrialDDR3l DDR3Lx16 2Gb F60C1A0002-M69W Device Features Density: 2G bits Organization 128Meg x 16 bits Package 96-ball FBGA Lead-free (RoHS compliant) and Halogen-free Power supply VDDNDDQ =1.35V(1.283 to 1.45V) ...

Brand Name:SK hynix Inc

Model Number:HY57V561620FTP-HI

HY57V561620FTP-HI DRAM Chip SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II Shipping: 1, We can shipping all over the world by DHL, UPS, FEdex, TNT . The packaging is very safe and strong. Please nitfy me you have any special needs 2, It will take around 3-5 days...

Brand Name:Micron Technology Inc.

Model Number:MT44K16M36RB-107E:B TR

...Product Category Resonators Mfr Micron Technology Inc． Series - Package Tape & Reel (TR) Product-Status Active Memory-Type Volatile Memory-Format DRAM Technology DRAM Memory-Size 576Mb (16M x 36) Memory-Interface Parallel Clock-Frequency 933 MHz Write-...

Brand Name:China chao sheng

Model Number:Computer memorymemoryPCB

Place of Origin:Shenzhen, Guangdong, China

...Substrate PCB,gold finger Product Description Computer memory 6-layer through hole, FR-4, TG150, Plate thickness 1.60mm, copper thickness 1OZ, Green solder resist, impedance, immersion gold 1u" + gold finger, Minimum line width 3/3mil Quantities range from prototype to volume production. 100% E-Test Packaging: Vacuum Packaging...

Model Number:AS4C256M8D3LC-12BIN

... ball FBGA PACKAGE New part electronic components: Model Package Date STM32F407ZET6 LQFP144 2020+/2019+ ADM2587EBRWZ-REEL7 SOP-20 2020+ LAN8720A-CP-TR QFN24 2020+ ...

Model Number:AS4C256M8D3LC-12BIN

... ball FBGA PACKAGE New part electronic components: Model Package Date STM32F407ZET6 LQFP144 2020+/2019+ ADM2587EBRWZ-REEL7 SOP-20 2020+ LAN8720A-CP-TR QFN24 2020+ ...

Place of Origin:Original

...Memory Format DRAM Memory Type Volatile Memory Size 64Mb (4M x 16) Speed 143MHz Interface Parallel Voltage - Supply 3 V ~ 3.6 V Operating Temperature 0°C ~ 70°C (TA) Package / Case 54-TSOP (0.400", 10.16mm Width) Supplier Device Package 54-TSOP II Shipment UPS/EMS/DHL/FedEx Express. Condtion New original factory. IS42S16400J-7TL Packaging...

Brand Name:Micron Technology

Model Number:MT53D1024M32D4DT-053 AIT:D

Place of Origin:USA

... Memory Type: SDRAM Mobile - LPDDR4 Installation style: SMD/SMT Package / Box: VFBGA-200 Data bus width: 32 bit Tissue: 1G x 32 Storage capacity: 32 Gbit ...

Categories:IC Integrated Circuits

Country/Region:china

...Memory & Data Storage Specifications Product Attribute Attribute Value Manufacturer: Micron Technology Product Category: DRAM RoHS: Details Mounting Style: SMD/SMT Package / Case: FBGA Organization: 1 G x 32 Memory Size: 32 Gbit Packaging: Reel Packaging: Cut Tape Brand: Micron Moisture Sensitive: Yes Product Type: DRAM Factory Pack Quantity: 2000 Subcategory: Memory...

Brand Name:Micron

Model Number:MT40A1G16TB-062E:F

Place of Origin:original

... 16Gbit Memory Organization 1G x 16 Memory Interface Parallel Clock Frequency 1.5 GHz Write Cycle Time - Word, Page 15ns Access Time 19 ns Voltage - Supply 1.14V ~ 1.26V Operating Temperature 0°C ~ 95°C (TC) Mounting Type Surface Mount Package /

Model Number:M393A4K40EB3-CWE

Place of Origin:Beijing, China

Products Description M393A4K40EB3-CWE 32G DDR4 3200 DRAM 2R X4 1.2V ECC RDIMM Server Memory Company Profile Why Choose Us Product package and shipping Payment FAQ

Brand Name:MICRON

Model Number:MT48LC4M16A2TG

Place of Origin:Original

... Dram MICRON Original Package TSOP Tray MT48LC16M4A2 – 4 Meg x 4 x 4 banks GENERAL DESCRIPTION The Micron® 64Mb SDRAM is a high-speed CMOS, dynamic random-access memory containing 67,108,864 bits. It is internally configured as a quadbank DRAM wit...

Brand Name:ISSI

Model Number:IS42S16800F

Place of Origin:USA

Micron ISSI Samsung IS42S16800F Electronic Components Integrated Circuits Ic Chips Product Paramenters Category Integrated Circuits (ICs) Memory Memory Mfr ISSI, Integrated Silicon Solution Inc Series - Product Status Obsolete Digi-Key Programmable Not ...

Brand Name:Micron Technology

Model Number:MT53E1G32D4NQ-046 WT:E

DRAM LPDDR4 32G 1GX32 FBGA WT QDP Product Attribute Attribute Value Select Attribute Manufacturer: Micron Technology Product Category: DRAM RoHS: Details Type: SDRAM Mobile - LPDDR4 Mounting Style: SMD/SMT Package / Case: VFBGA-200 Data Bus Width: 32 bit Organization: 1 G x 32 Memory Size: 32 Gbit Series: MT53E Packaging: Tray Brand: Micron Product Type: DRAM...

Brand Name:ISSI

Model Number:IS42S32800J-6BLI-TR

Place of Origin:Original

...DRAM 256M, 3.3V, SDRAM, 8Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R Product Attribute Attribute Value Manufacturer: ISSI Product Category: DRAM RoHS: Details Type: SDRAM Mounting Style: SMD/SMT Package / Case: BGA-90 Data Bus Width: 32 bit Organization: 8 M x 32 Memory...

Brand Name:CISCO

Model Number:AIR-AP3802E-E-K9

Place of Origin:Mexico

...Permit Antenna Gains: up to 6 dBi DRAM: 1024 MB Flash Memory: 256 MB Net Weight: 2.09 Kg Dimensions: 22 x 22 x 6.7 cm Warranty: One Year Packaging & Delivery Packaging Details Original Cisco AIR-AP3802E-E-K9 Packaging. Port Shanghai New Cisco Aironet 3802e

Brand Name:TOPCBS

Model Number:4Layer flex board with immerison gold apply for 4G phone

Place of Origin:Suzhou China

4Layer flex board with Finished treatment Gold apply for 4G phone Mechanical Stability: The rigid-flex designs are composed of multiple layers of flexible substrates attached to one or more rigid boards, offering both stability and flexibility for ...