bga package system on chip

Brand Name:Original Factory

Model Number:S28HS01GTGZBHI030

Place of Origin:CN

Integrated Circuit Chip S28HS01GTGZBHI030 BGA Package 1024MBit Memory Chips​ Product Description Of S28HS01GTGZBHI030 S28HS01GTGZBHI030 is 1024MBit, 400MByte/s, Industrial Memory Chip. Specification Of S28HS01GTGZBHI030 Part Number S28HS01GTGZBHI030 ...

Brand Name:XILINX / AMD

Model Number:XC6SLX150-2FGG676I

Place of Origin:original

...Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package...

Brand Name:BROADCOM

Place of Origin:China

Model Number:BCM56567B0KFSBG

... in a wide range of applications. It features high-performance gate array IC design, programming cycles from 100 to 10000, and a variety of packages including QFP, BGA, and more. This chip is capable of

Model Number:G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB

Brand Name:PG

Place of Origin:Shenzhen, China

Industrial eMMC 5.1 BGA 153 Ball Embedded Chips Industrial-grade eMMC 5.1 embedded chips featuring BGA 153-ball packaging with capacities of 64GB, 128GB, and 256GB. These high-reliability, high-performance storage solutions are specifically engineered for ...

Place of Origin:Malaysia

Brand Name:N/A

Model Number:MPC8260AZUPIBB

MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active Core Processor MSP430 Core Size 16-Bit Speed ...

Brand Name:XILINX

Model Number:XC7A200T-3SBG484E

Place of Origin:original

XC7A200T-3SBG484E BGA Components New Original Tested Integrated Circuit Chip IC XC7A200T-3SBG484E To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided. We attach ...

Brand Name:Qualcomm

Model Number:CSR8645B04-IBBC-R

Place of Origin:USA

CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute Manufacturer: Qualcomm RF360 Product ...

Brand Name:UNICOMP

Model Number:CX7000L

Place of Origin:China

Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic...

Brand Name:C2MICRO TI

Model Number:CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR

Place of Origin:Malaysia

Electronic components Integrated Circuits (ICs) CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR C2MICRO TI BGA VQFN48 VQFN32 IC Integrated Circuits Components Specification :CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR Category Integrated Circuits (...

Brand Name:C2MICRO TI

Model Number:CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR

Place of Origin:Malaysia

Electronic components Integrated Circuits (ICs) CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR C2MICRO TI BGA VQFN48 VQFN32 IC Integrated Circuits Components Specification :CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR Category Integrated Circuits (...

Model Number:XC7Z100-2FFG900I

XC7Z100-2FFG900I Bga900 Embedded Communication Chip XC7Z100-2FFG900I XC7Z100-FFG900 XC7Z100-2FFG900 XC7Z100 FBGA900 IC Our goods: Active components (IC integrated circuits, memory chips, diodes, transistors, etc.) Passive components (capacitors, resistors...

Brand Name:Hiner-pack

Model Number:HN23111

Place of Origin:SHENZHEN CN

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Brand Name:QUALCOMM

Model Number:IPQ4019-0vv

Place of Origin:AMERICA

Brand Name:Shinelink

Model Number:SL0925S01

Place of Origin:China

...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

... of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of

Brand Name:XILIN

Model Number:XQR17V16CC44V

...: programmable ic chips , integrated circuit chips XQR17V16CC44V Specification.pdf Part number:XQR17V16CC44V Stock Quantity:1000pcs Specifications for XQR17V16CC44V: Mfr Package Description CERAMIC, LCC-44 Package Equivalence Code LDCC44,.7SQ Number of

Model Number:LMV358IDR

Place of Origin:original factory

Stock Offer (Hot Sell) Part No. Quantity Brand D/C Package MT29F8G08ADADAH4-IT:D 2972 MICRON 14+ BGA MT41J128M16HA-15E:D 2272 MICRON 13+ BGA MT41K256M16HA-125:E 8138 MICRON 15+ BGA MT46H32M16LFBF-6IT:C 3135 MICRON 12+ BGA MT46H64M16LFBF-5IT 2231 MICRON 14...

Brand Name:GCT

Model Number:GDM7243SB10CGT

Place of Origin:Original Manufacturer

...BGA COMPUTER IC CHIPS ORIGINAL NEW CONDITION 365 DAYS WARRANTY Detailed Product Description Commdity: GDM7243SB10CGT Lead Time: 2-3 DAYS Package: Standard Packaging Warranty: 365 Days Shipping Ways: China Post/DHL/FEDEX/UPS/TNT/DPEX/KAS Payment Ways: TT / Escrow 10(we Pay Hkinventory Escrow Fee) / Paypal / Western Union High Light: computer integrated circuits , integrated circuit chips...

Brand Name:ST

Place of Origin:original

Model Number:STM32F373RBT6

...Chip provides a wide range of integrated circuit products with different packages, types, power, temperatures and voltage levels. The most popular product from ST Micro Chip is STM32F091CCT6, STM32F100VBT6B and STM32F091CCT6TR. These products are available in DIP, SOIC, QFN and BGA packages...