bga fcbga package substrate

Brand Name:UNICOMP

Model Number:AX9100max

Place of Origin:China

... a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic ...

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which

Brand Name:XILINX / AMD

Model Number:XC7K160T-L2FBG676E

Place of Origin:original

...FCBGA Package Embedded FPGAs Automotive Grade Industrial Device 0.93V Number of LABs/CLBs 12675 Number of Logic Elements/Cells 162240 Total RAM Bits 11980800 Number of I/O 400 Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:Chippack

...adaptability, and compatibility with end devices. For image sensors of various sizes provided by customers across different industries, we offer customized packaging services for PLCC, BGA, and ceramic housings. Using sensor size parameters as the core, we

Brand Name:PG

Place of Origin:Shenzhen, China

Model Number:G2864TLCA/ G28128TLCA/ G28256TLCA

High Reliability Automotive Grade EMMC5.1 with 5 Years Warranty Storage Component 64GB 128GB 256GB BGA 153 Package Available in 64GB, 128GB, and 256GB capacities with BGA 153 package, this automotive-grade eMMC 5.1 storage component delivers exceptional ...

Brand Name:Hiner-pack

Model Number:HN1837

Place of Origin:Shenzhen China

BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing ...

Brand Name:Original Factory

Model Number:STM32F439NIH6

Place of Origin:CN

...BGA-216 Package Product Description Of STM32F439NIH6 STM32F439NIH6 is a 32-bit RISC processor that features exceptional code-efficiency, delivering the high-performance expected from an Arm core in the memory size usually associated with 8- and 16-bit devices. Specification Of STM32F439NIH6 Part Number: STM32F439NIH6 Package: BGA...

Brand Name:Mingseal

Model Number:GS600SU

Place of Origin:China

The GS600 Series Inline Jet Underfill Dispenser is Mingseal’s next-generation solution engineered specifically for FCBGA encapsulating applications, where process stability, ultra-fine dispensing paths, and precise glue control are critical to yield and ...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...

Categories:IC Substrate PCBs

Country/Region:china

Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, ...

Categories:IC Substrate PCBs

Country/Region:china

Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;}img, picture, video, canvas, ...

Brand Name:Analog Devices

Model Number:ADIS16475-2BMLZ

ADIS16475-2BMLZ Analog Device BGA-44 Precision, Miniature MEMs IMU Precision 2621440deg/s/LSB 262144000LSB/g SPI 3V 3.6V New Origianl 100% New Original Brand Lead time: 1-2working days( enough in stock) Product Pictures Related Product Long-term large ...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Model Number:UV396US

Brand Name:KHJ

Place of Origin:China

Description UV396US is a single-sided, UV-curable release tape engineered for temporary bonding applications. It offers strong initial tack that holds materials firmly in place during processing; after exposure to UV light, the adhesive's bonding force...

Brand Name:Jiaqing Circuit

Place of Origin:China

...substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

... of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of

Categories:BGA PCB Assembly

Country/Region:china

..., China factory. BGA assembly represents the most demanding category of SMT manufacturing, where hundreds or thousands of solder ball connections hidden beneath component bodies must achieve consistent, void-free wetting to both the package substrate and

Brand Name:Broadcom Limited

Model Number:PEX8648-BB50RBCG

...FCBGA-676 Rohs Code Yes Part Life Cycle Code Active Ihs Manufacturer BROADCOM INC Package Description FCBGA-676 Reach Compliance Code compliant HTS Code 8542.31.00.01 Bus Compatibility I2C JESD-30 Code S-PBGA-B676 JESD-609 Code e1 Moisture Sensitivity Level 4 Number of Terminals 676 Package Body Material PLASTIC/EPOXY Package Code BGA Package Shape SQUARE Package...

Place of Origin:TAIWAN

Brand Name:ATI

Model Number:216-0731004

...BGA GPU chips video 216-0731004 is a GPU chip. Place of Origin: TAIWAN Brand Name: ATI Model Number: 216-0731004 Type: Drive IC Application: MP3/MP4 Player Supply Voltage: 3V Dissipation Power: W Operating Temperature: C package: FCBGA WE also have others BGA...