TO8 Header Encapsulated Components Transistor Outline Package
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Product name: Sealed enclosure alloy package for circuit Finish: Fully plating Au or selective plating Au. Plating coating: Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap plating Ni:4-11.43um. Product formation: Material Quantity 1. Cap 10#......
JOPTEC LASER CO., LTD
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TO63-03A Hermetic Sealing Package for Power Devices
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Product Overview Product Name: TO63-03A Hermetic Sealing Package Model Number: TO63-03A Package Type: TO-style metal can (Transistor Outline) Sealing Technology: Glass-to-Metal Sealing (GTMS) Materials: Housing: Kovar alloy (Fe-Ni-Co) or stainless steel ......
Huona (Shanghai) New Material Co., Ltd.
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