Customized Thermally Conductive Electrical Insulator Sheet Thermal Interface Materials For Power Semiconductors
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... and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and...
Dongguan Ziitek Electronical Material and Technology Co., Ltd
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TIF100-50-11S CPU Thermal Pad Silicone Thermal Interface Material 5.0W RoHS Compliant For Cooling Of Automotive Electronics
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...the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Their flexibility and...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Soft Thermal Conductive Insulating Gasket For Heat Transfer With Soft Compressible Tear-resistant Silicone Thermal Interface Materials
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... insulating product. lt incorporates insulating silicone substrates into thermally conductive materials to achieve both insulation and heat conduction. At the same time, the glass fibers provide excellent tear and puncture resistance. The product is...
Dongguan Ziitek Electronical Material and Technology Co., Ltd
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
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High Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and ......
Trumony Aluminum Limited
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5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
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5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
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Silicone Free Thermal Interface Materials Pad Thermal Gap Filler Pad
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Thermal Pad Gap Filler Silicone Free Tflex SF10 Laird Thermal Conductivity 10 W/Mk Product Description Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has ......
ZSUN CHIPS CO., LTD
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Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
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...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal...
Shenzhen Aochuan Technology Co., Ltd
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High-Purity White D50 Spherical Alumina Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials
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...Thermal Interface Materials This premium spherical alumina powder features exceptional globularity and high thermal conductivity, manufactured through advanced high-temperature melting technology. With its unique spherical morphology and high α-Al₂O₃ content, it delivers superior performance as a functional filler in thermal interface materials......
Shaanxi KeGu New Material Technology Co., Ltd
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ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease
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... with a pre-flash viscosity of 80 Pa·s, post-flash viscosity of 700 Pa·s, thermal conductivity of 6.2 W/m·K, thermal resistance of 6.1 mm²·K/W, and bond line thickness of 26 μm. Product Overview Optimized for screen printing, stencil printing,...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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