ROHS PC JEDEC Standard Matrix Tray For IC Device 0.76mm Flatness
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...JEDEC Matrix Tray For IC Device 0.76mm Flatness The JEDEC matrix tray is mainly used for chip packaging testing in the semiconductor industry.Because IC chips are tiny and thin, they are extremely vulnerable to damage during storage and transportation. So customers often use the JEDEC tray for packaging protection. It is a standard tray used to transport, store and pack the electronic components. The products not only comply with JEDEC...
Shenzhen Hiner Technology Co., Ltd.
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Durostone Material SMT Matrix Trays with Custom Pocket Dimensions
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...Matrix Trays With Custom Pocket Dimensions CWSC-5 Benefits 1. Machined with custom pocket dimensions for safe handling and package protection 2. Allows Surface Mount components to be picked up in a repeatable fashion when tape and reel is not an option 3. Provides pick and place SMT package presentation solution for components for which no standard JEDEC tray......
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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JEDEC Standard eMCP IC Package Substrate Fabrication
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Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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CD4069UBPWR 6 Circuit Programmable Logic ICS Inverters Hex Standardized Symmetrical Output
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...ICS Inverters Hex 1 Features Standardized symmetrical output characteristics Medium speed operation: tPHL, tPLH = 30 ns at 10 V (Typical) 100% Tested for quiescent current at 20 V Maximum input current of 1 μA at 18 V over full package-temperature range, 100 nA at 18 V and 25°C Meets all requirements of JEDEC tentative standard No. 13B, Standard......
ChongMing Group (HK) Int'l Co., Ltd
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Integrated Circuit Chip IS21TF64G-JCLI 512Gbit eMMC 5.1 Interface 153-VFBGA Memory IC
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...TLC Mode NAND and eMMC controller inside as one JEDEC standard package, providing a standard interface to the host. Specification Of IS21TF64G-JCLI Part Number: IS21TF64G-JCLI Operating Temperature: -40°C ~ 85°C (TA) Configuration: TLC ......
ShenZhen Mingjiada Electronics Co.,Ltd.
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ATF1504AS-10JU44 Programmable IC Chip - High Speed 4K Gate Capacity Low Power Consumption
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... Standard Device • High Reliability and High Performance • Low Power Consumption • Enhanced Testability • 4-Level Programmable Outputs • 5V or 3.3V Supply Voltage • Up to 1.5 Million Gates • Fully Compatible with JEDEC Standard Device •...
Shenzhen Sai Collie Technology Co., Ltd.
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IRF1407 75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package Power Supply Unit replacement chip
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IRF1407 75V Single N-Channel HEXFET Power MOSFET in a TO-220AB package Features: Planar cell structure for wide SOA Optimized for broadest availability from distribution partners Product qualification according to JEDEC standard Silicon optimized for ......
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
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AT27C256R-15PCProgramming IC Chips Original DIP Electronics Chip 256K OTP EPROM
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... at 5 MHz • JEDEC Standard Packages – 28-Lead 600-mil PDIP – 32-Lead PLCC – 28-Lead TSOP and SOIC • 5V ± 10% Supply • ......
Anterwell Technology Ltd.
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128GBIT THGAMVG7T13BAIL IC FLASH EMMC 153FBGA Memory IC Tray
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...IC FLASH 128GBIT EMMC 153FBGA Memory IC Tray The THGAM eMMC flash memory feature integrated memory management with error correction code, bad block management, wear-levelling, and garbage collection. These flash memories come in a FBGA package and standard......
Shenzhen Xinyuanpeng Technology Co., Ltd.
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eMMC Flash Memory Storage IC Chip BGA153 Package Embedded Automotive Grade eMMC
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... Based on JEDEC standards, it integrates flash memory chips and controllers and is directly soldered onto automotive electronic control unit (ECU) circuit boards. This solution ......
China Chips Star Semiconductor Co., Ltd.
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