High Precision Foam Bonding Machine for Measuring length 380V
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... QHFH-2150 Reel material width max 1650mm 2150mm Reel material speed 50m/min 50m/min Machine weight 950kg 1000kg Power 0.75kw 0.75kw Machine external size L2500 * W8300 * H1500mm L3000 *...
Dongguan Zehui machinery equipment co., ltd
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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
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...High Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die bonding technology Bottom photo-taking, high precision......
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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High Precision ACF Bonding Machine Repair Fast Bonding Time Button Operation
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...Bonding Machine TV LCD Panel for Cof/Tab Bonding Replacement LCD TV Panel Bonding Machine Description This equipment is suitable for a variety of FPC / COF / TAB and LCD or PCB board combination bonding. It is a professional high precision repair equipment for reparing 2K, 4K and curved screen different sizes of LCD screen cable damage or natural fall off. LCD TV Panel Bonding Machine Features Heat cure Fast bonding time High...
Guangzhou Chuang Li You Machinery Equipment Technology Co., Ltd
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High Precision FPC Bonding Machine , Hot Bonding Machine Three Heating Sections
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...Machine-FPC Precision Hot Bar Bonding Machine,SMTfly-PP1A Specifications: Working area (mm) 200 × 260 Working pressure (pa) 0.6-0.8 Working environment 10-60 ℃, 40% -95% Hot pressing time (S) 1 ~ 99.9 Positioning fixture 1 Temperature settings RT ~ 500 ℃ deviation ± 5 ℃ Machine size (mm) 590 × 640 × 620 Hot-pressing accuracy (pa) 0.2 Machine weight (kg) 95 Welding pressure 1 ~ 20Kg Hot Bar Soldering Machine-FPC Precision......
Shenzhen SMTfly Electronic Equipment Manufactory Ltd
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Advanced High Precision Walnut Kernel Grading Machine AI Neural Network 12 Channel Multi-Grade Nut Color Classifier
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... channels. The deep learning algorithms process color, shape, texture, and brightness data for each kernel with human-like perception. Engineered as a high-capacity walnut kernel sorting solution, this 8-lane machine achieves 0.72 t/h...
Hefei Jinguoyuan Vision Technology Co., Ltd.
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BHM-45S High Precision Sliding Table Saw with 3200mm Sliding Table, 5.5KW Motor, and Electric Lifting System for Woodworking
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...High Precision Sliding Table Saw The BHM-45S Industrial Sliding Panel Saw with Electric Lifting and Digital Display represents the pinnacle of industrial woodworking engineering, designed specifically for professional joiners and high-volume manufacturing environments. Combining a robust 3200mm sliding carriage with a high-torque motor system, this machine......
Qingdao Baihang Industry and Trade Co., Ltd
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PE Foam Bonding Machine, Open Fire Type EPE Bonding Cutting Gluing Machine
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...e of PE foam sheet to nearly melting point via direct LPG flame. Then bond 2 pieces together. The bonding force is by 2 rollers. No agent nor glue is needed. Maximum bonding thickness may reach 100 mm. It is a must have equipment of PE foam deep process....
Firstop Group Co. Limited
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EPE foam bonding machine
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...-ZH Series foam sheet (pearl wool) bonding machine is essential special equipment for deep processing. It is used to bond double or multi-layer when the thickness of once forming sheet is insufficient. The thickness after processing can reach 4-100mm thus...
Longkou FuChang Packing Machinery Co.,Ltd
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FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment
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...Machine High-precision thermal bonding equipment designed for precision soldering applications requiring controlled thermal management. Technology Overview Hot bar soldering is highly effective for bonding dissimilar components that are difficult to unite using traditional methods. This pulse bonding......
YUSH Electronic Technology Co.,Ltd
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TR7700QE S SMT AOI Machine Ultra High Precision 3D AOI Machine
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...platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with...
INFINITE AUTOMATION CO ., LIMITED
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