eMMC IC Package Substrate PCB
|
...IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics. Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC assembly,Storage IC substrage; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:FR4......
HongRuiXing (Hubei) Electronics Co.,Ltd.
|
2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
|
2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
|
MASTERGAN6 GaN IC 650V Enhancement Mode GaN Transistors QFN-32 Integrated Smart GaNs
|
MASTERGAN6 GaN IC 650V Enhancement Mode GaN Transistors QFN-32 Integrated Smart GaNs Product Overview MASTERGAN6 GaN IC 650V Enhancement Mode GaN Transistors in QFN-32 package featuring integrated Smart GaN technology. MJD Advantage 15 years experience......
ShenZhen Mingjiada Electronics Co.,Ltd.
|
Intelligent Vision IC Programmer KR42-2500-RUA, Industrial High Reliability, Universal for Full-Spec Components
|
... out, tray in and tape out, tape in and tape out,tray in and tray out,tube in and tray out,tube in and tape out. rosoft It supports a wide range of chip packages,...
Shenzhen Jinchuangtu Electronic Equipment Co., Ltd.
|
Mimaki UJ330H-160 Industrial Hybrid UV LED Printer: The 1.6m Multi-Functional Flagship Combining Roll-to-Roll Productivity with Rigid Substrate Printing.
|
The Mimaki UJ330H-160 is a revolutionary hybrid UV LED printer within the flagship 330 Series. Designed to break the boundaries of media compatibility, this model handles flexible rolls with high efficiency and can be instantly converted into a flatbed ......
Henan Joyin Digital Technology Co., Ltd.
|
IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
|
Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
|
Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
|
... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
|
ESD Plastic JEDEC Standard Matrix Tray For IC Packaging
|
... is the packaging tray used by the enterprise for its chip packaging test. Because the IC chip is small and thin, the enterprise will generally take external protection to avoid scratches and damage. JEDEC Matrix Tray, which is a satisfactory storage of...
Shenzhen Hiner Technology Co., Ltd.
|
ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63
|
ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, SEPIC Output Type ......
Shenzhen Sai Collie Technology Co., Ltd.
|
IC Packaging Parts Inline Cleaning System With Trial Chemical Wash Sections
|
...a IC packaging parts auto cleaning system with trial chemical wash sections. SC830 is a high wash ability FC packaging deflux cleaning system. 810 IC packaging auto cleaing machine is used to clean flux residuals, soder balls and particles on FC package ......
Dongguan Shenhua Mechanical and Electrical Equipment ...
|