ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate
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COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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1200mA Amber RGB LED Array , 150W Quad RGBW COB Package LED Arrays
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...COB Package LED Arrays Features: Completely mixing for any 2 colors, no light spot Interlaced & even light array distribution for 3 colors, pure and well-distributed light for each Adaptable for various angle of Lens and reflectors Variety of power selections for different applications COB Package LED Arrays, high performance Heat emitting Al. PCB substrate......
GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
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FR4 TG180 Metal Substrate PCB Laser Hole 0.10mm For Military Department Module
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...,FR-4, TG180 + Deep Digging Intaglio IC Package Metal four layer pcb Substrate PCB Product Description Layer number: 16L Plate thickness: 6.0 mm Process Structure: FR-4, TG180 + Deep Digging Intaglio IC Package ,Laser hole 0.10mm Surface treatment: sinking......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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UV Curing Systems For Printing 1500W COB Package Lamp Beads UV Curing Lamp
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UV Curing Systems For Printing 1500W COB Package Lamp Beads UV Curing Lamp UV Curing Systems For Printing Product Description The UV LED module can be water-cooled or air-cooled. Various powers, sizes and circuits can be customized according to your ......
shenzhen yuanming co., ltd
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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PLC Control UV LED Curing Equipment High Density A330 COB Package
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UV LED curing system for offset printing UV LED Curing ink UV LED water cooling system Currently, UV LED arrays are cooled with either air or liquid. It is important to note that as the LEDs emit higher output power, the more heat is generated. Thus in ......
Wuhan UV LEDTek Co.,Ltd
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Factory Outlet COB LED Chip 3538 Five Color COB LED Chips 250W-350W 90-140lm/w 35*38MM LED Photograph Light With Fast Shipments
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...SUBSTRATE 3538 SERIES 250W/350W Five colors COB 620nm/460nm/520nm/2700K /6500K 90 2A*5 24-26V 35X38MM 26MM 120° 95 Boss thermal and electrical separation copper substrate + aluminum nitride structure COB (Chip on Board) LED is an LED packaging technology that directly connects LED chips to the PCB substrate instead of using traditional LED packaging. The advantages of five-color COB...
Shenzhen Learnew Optoelectronics Technology Co., Ltd.
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1919 Bi-Color COB LED Chip 8W+8W 300mA CCT 2000K-7000K With High CRI 90
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...COB Led Chip Introductions COB LEDs are basically multiple LED chips packaged directly to a substrate by light to form a single LED module. The multiple chips take up less space and the highest potential of the LED chips can be obtained. When the COB LED package is energized, it appears more like a lighting panel. With the advanced knowledge and packaging technology for years, COB......
Shenzhen Huanyu Dream Technology Co., Ltd
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Black Soldermask FR4 BGA Board FR4 PCB 1.6mm Thickness / Immersion Gold
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... PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen, FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its...
Shenzhen Xinchenger Electronic Co.,Ltd
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