S28HS01GTGZBHI030 Integrated Circuit Chip BGA Package 1024MBit Memory Chips
|
Integrated Circuit Chip S28HS01GTGZBHI030 BGA Package 1024MBit Memory Chips Product Description Of S28HS01GTGZBHI030 S28HS01GTGZBHI030 is 1024MBit, 400MByte/s, Industrial Memory Chip. Specification Of S28HS01GTGZBHI030 Part Number S28HS01GTGZBHI030 ......
ShenZhen Mingjiada Electronics Co.,Ltd.
|
XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources
|
...Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package......
Shenzhen Sai Collie Technology Co., Ltd.
|
High Density PCB Micro BGA Package Assembly Service Integrated Solution
|
...BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection ♦ What is BGA Assembly? BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA......
DQS Electronic Co., Limited
|
BCM56567B0KFSBG Programmable IC Chip Ethernet Switch IC BGA Package
|
... in a wide range of applications. It features high-performance gate array IC design, programming cycles from 100 to 10000, and a variety of packages including QFP, BGA, and more. This chip is capable of...
STJK(HK) ELECTRONICS CO.,LIMITED
|
Industrial eMMC 5.1 BGA 153 Ball Embedded Chips 64/ 128/ 256GB emmc for Industrial Robot
|
Industrial eMMC 5.1 BGA 153 Ball Embedded Chips Industrial-grade eMMC 5.1 embedded chips featuring BGA 153-ball packaging with capacities of 64GB, 128GB, and 256GB. These high-reliability, high-performance storage solutions are specifically engineered for ......
China Chips Star Semiconductor Co., Ltd.
|
High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp
|
... PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone ......
Unicomp Technology
|
MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package
|
MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active Core Processor MSP430 Core Size 16-Bit Speed ......
Mega Source Elec.Limited
|
Black JEDEC Tray for BGA-Packaged Chip Complies With Standard Design Matrix 8x16=128PCS
|
Black JEDEC Tray That Holds The BGA-Packaged Chip Complies With Standard Design Product Description: JEDEC Trays: The Safest Way to Handle and Transport Semiconductor Devices When it comes to semiconductor devices such as integrated circuits (ICs), safe ......
Shenzhen Hiner Technology Co., Ltd.
|
CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360
|
CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute Manufacturer: Qualcomm RF360 Product ......
QIN XIN (HONG KONG) ELECTRONIC TECHNOLOGY CO.,LIMITED
|
High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages
|
BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture ......
Shenzhen Jiaqing Circuit Co., Ltd.
|