Black JEDEC Tray for BGA-Packaged Chip Complies With Standard Design Matrix 8x16=128PCS
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Black JEDEC Tray That Holds The BGA-Packaged Chip Complies With Standard Design Product Description: JEDEC Trays: The Safest Way to Handle and Transport Semiconductor Devices When it comes to semiconductor devices such as integrated circuits (ICs), safe ......
Shenzhen Hiner Technology Co., Ltd.
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BGA type packaging memory substrate manufacture
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...Substrate pcb BGA package is one of the semiconductor package types on memory electronics manufacture,It required the substrate ball high quality guarantee,It is also one of types of the semiconductor package substrate,for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally,the IC substrate......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages
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...substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate......
Shenzhen Jiaqing Circuit Co., Ltd.
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Iphone IC Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip
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...Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip Product Description Of APL1096/343S00474 APL1096/343S00474 is IC Chip - Power Management Circuit, BGA Package. Specification Of APL1096/343S00474 Part Number: APL1096/343S00474 Package: BGA Category: Iphone IC Chip Mounting Type: Surface Mount Product Photo Of APL1096/343S00474 Other Electronic Components In Stock Part Number Package PPC405EXR-NPD333T BGA......
ShenZhen Mingjiada Electronics Co.,Ltd.
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XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources
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...Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package......
Shenzhen Sai Collie Technology Co., Ltd.
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EMMC5.1 256GB Mini Size eMMC5.1 Low Cost BGA Memory Chip Low Power For Smart Toy Speaker Sensor
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... Ultra Small BGA Compact Packaging Mini ultra-small BGA packaging, tiny chip size, fit small-size PCB circuit boards of mini electronic toys and tiny sensing equipment. Ultra Low Power Small Embedded Chip Ultra-low power consumption design, suitable for...
China Chips Star Semiconductor Co., Ltd.
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AMD ATI Radeon 216-0731004 GPU new Computer IC Chips BGA GPU chips video
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...Chips BGA GPU chips video 216-0731004 is a GPU chip. Place of Origin: TAIWAN Brand Name: ATI Model Number: 216-0731004 Type: Drive IC Application: MP3/MP4 Player Supply Voltage: 3V Dissipation Power: W Operating Temperature: C package: FCBGA WE also have others BGA......
Mega Source Elec.Limited
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High Density PCB Micro BGA Package Assembly Service Integrated Solution
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...BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection ♦ What is BGA Assembly? BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA......
DQS Electronic Co., Limited
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High Purity 99.7% Al2o3 Ceramic Substrate For LED Packages Chip Resistors
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Product Description High Purity 99.7% Al2o3 Ceramic Substrate For LED Packages,Chip Resistors Alumina Ceramic: Alumina ceramics are classified into high-purity type and ordinary type. The high-purity alumina ceramics have a Al2O3 content of 99.9% or mor......
Wuxi Special Ceramic Electrical Co.,Ltd
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Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution
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...BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications Quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip......
Unicomp Technology
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